Mark LaPedus on Muck Rack

Mark LaPedus

San Jose, CA
Executive Editor, Semiconductor Engineering

Executive Editor -- Semiconductor Engineering.

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@MarkLaPedus — 413 followers, 737 tweets

Nov 17, 2017

Five Trends In IC Packaging..  A reporter’s takeaways from recent packaging events. 

Nov 17, 2017

What’s Next For Atomic Layer Etch? Technology begins shipping, but which approaches work best, and where, is still not clear.

Nov 17, 2017

Overlay Challenges On The Rise.....Move to 10/7nm and beyond creates need for more precise metrology and alignment within different chip layers.

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