Trevor Galbraith on Muck Rack

Trevor Galbraith

United States
Editor in Chief — Global SMT & Packaging

Editor-in-Chief Global SMT & Packaging magazine

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@TG1956 — 195 followers, 143 tweets

Deadlines ----- The deadline for Abstracts is: February 16th, 2018. In the first instance, please send them to the Conference Chair, Trevor Galbraith at tgalbraith@globalsmt.net  https://lnkd.in/eQ9F_7s 
RT @davidbergmanipc: Come see why over 25 companies are excited about IPC CFX. Look for the CFX logo on the show floor. #CFXLIVE;… https://t.co/BDBH6TFjy7
Global SMT TV Panel Discussions from IPC APEX EXPO 2018  https://lnkd.in/ePxY3yp 
RT @SMTAorg: Pan Pacific Microelectronics Symposium is this week on the Big Island of Hawaii. Looks like our session chairs and… https://t.co/tb9IWcdkLa
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