Trevor Galbraith on Muck Rack

Trevor Galbraith

United States
Editor in Chief — Global SMT & Packaging

Editor-in-Chief Global SMT & Packaging magazine

Search Tweets

Twitter Feed

@TG1956 — 195 followers, 143 tweets

Deadlines ----- The deadline for Abstracts is: February 16th, 2018. In the first instance, please send them to the Conference Chair, Trevor Galbraith at 
RT @davidbergmanipc: Come see why over 25 companies are excited about IPC CFX. Look for the CFX logo on the show floor. #CFXLIVE;…
Global SMT TV Panel Discussions from IPC APEX EXPO 2018 
RT @SMTAorg: Pan Pacific Microelectronics Symposium is this week on the Big Island of Hawaii. Looks like our session chairs and…
Show More