Advanced Packaging
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Advanced Packaging International is a global platform for connecting, informing and inspiring the advanced packaging industry. This event brings together leading innovators, industry experts and academics to explore the materials, methods and technologies shaping the next era of semiconductor innovation. Through presentations, expert panels and networking opportunities, AP International delivers insights that help attendees optimise packaging architectures, advance thermal management, integrate heterogeneous solutions and enhance incumbent technologies. As part of AngelTech, this event offers access to a wider ecosystem, creating valuable opportunities for collaboration and growth across the full semiconductor supply chain. Source
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| Scope | International, Trade/B2B |
|---|---|
| Language | English |
| Country | United Kingdom |
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Recent Articles
Search ArticlesBBCube platform advances AI chip packaging
Researchers at the Institute of Science Tokyo have developed BBCube, a next-generation semiconductor integration platform that combines advanced chip packaging, high-density interconnects and thermal management to address key challenges in AI hardware.
LITILIT expands AI laser production
Lithuanian laser manufacturer says AI infrastructure growth is driving demand for precision laser processing in advanced semiconductor packaging and optical interconnects. LITILIT says the rapid expansion of AI data centre infrastructure is increasing demand for femtosecond laser technology used to manufacture advanced semiconductor packaging and optical interconnect components.
Atomica launches AI photonic platform
Atomica has launched its AI Photonic Integration Platform, a microfabrication platform designed to help developers integrate photonics, electronics, memory, thermal management and packaging into manufacturable AI systems. The new platform is the latest addition to Atomica's AI infrastructure portfolio, following its AI Optical Connectivity Platform and AI Optical Source Platform.
AI fuels advanced packaging growth
A new BCC Research report forecasts strong growth in advanced chip packaging, fuelled by AI infrastructure, high-performance computing and increasing adoption of chiplet-based architectures. The global advanced chip packaging technologies market is expected to reach $87.6 billion by 2030, growing at a compound annual growth rate (CAGR) of 14.8% from $38.6 billion in 2024, according to a new report from BCC Research.
How materials will unlock the future of advanced packaging
Magazine Feature This article was originally featured in the edition: Issue 1 - 2026 As transistor scaling reaches its physical limits, advanced packaging has become the critical enabler of next-generation semiconductor performance, powering the shift from 2D scaling to 3D integration, chiplets, and trillion-transistor systems. By Jon Kemp, CEO, Qnity For decades, the story of our industry was a single word: shrink.
When mechanics become yield-critical: motion design for the advanced packaging era
Magazine Feature This article was originally featured in the edition: Issue 1 - 2026 Advanced packaging has created new process bottlenecks related to the internal mechanics of the packaging equipment. As alignment tolerances compress from microns to tens of nanometers, motion platforms stop being background automation and instead become yield-critical infrastructure. By Justin Bressi, Business Development Manager, Aerotech Inc.
From lab demonstration to pilot-line validation: Micro-transfer printing for heterogeneous integration
Magazine Feature This article was originally featured in the edition: Issue 1 - 2026 Micro-transfer printing (MTP) is moving from single-device demonstrations on individual chips to wafer-scale validation. At imec and Ghent University, the TRANSVERSE pilot line is evaluating whether this technique can meet the manufacturing metrics that matter for heterogeneous photonic integration: overlay, transfer yield, throughput, backend compatibility and post-transfer device performance and reliability.
Building standards for the next era of advanced packaging
Magazine Feature This article was originally featured in the edition: Issue 1 - 2026 AP Magazine Editor Sarab Chopra speaks with Peter O’Brien, Head of Photonics Packaging at Tyndall National Institute, about how standardisation, chiplets and photonic-electronic integration are shaping the future of advanced packaging.
Unleashing the intelligence revolution
Magazine Feature This article was originally featured in the edition: Issue 1 - 2026 TSMC’s 2026 Europe Technology Symposium revealed how AI is reshaping the semiconductor industry, driving advances in leading-edge logic, advanced packaging, photonics and system-level integration while accelerating the path to a trillion-dollar market.
Advanced packaging moves to the center of system innovation
Magazine Feature This article was originally featured in the edition: Issue 1 - 2026 At ECTC 2026, advances in heterogeneous integration, hybrid bonding, advanced substrates, photonic packaging, and thermal management underscored a fundamental shift in semiconductor innovation, one where system performance is increasingly defined by packaging and integration technologies rather than transistor scaling alone.