Advanced Packaging
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Advanced Packaging International is a global platform for connecting, informing and inspiring the advanced packaging industry. This event brings together leading innovators, industry experts and academics to explore the materials, methods and technologies shaping the next era of semiconductor innovation. Through presentations, expert panels and networking opportunities, AP International delivers insights that help attendees optimise packaging architectures, advance thermal management, integrate heterogeneous solutions and enhance incumbent technologies. As part of AngelTech, this event offers access to a wider ecosystem, creating valuable opportunities for collaboration and growth across the full semiconductor supply chain. Source
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| Scope | International, Trade/B2B |
|---|---|
| Language | English |
| Country | United Kingdom |
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Recent Articles
Search ArticlesWiwynn, Ayar Labs and GUC demonstrate CPO
Live demonstration at OCP Global Summit 2026 showcases optical engine telemetry and system-level integration for AI infrastructure. Wiwynn, Ayar Labs and Global Unichip Corp. (GUC) have demonstrated a co-packaged optics (CPO) system integrating optical engines with a compute platform, marking progress towards deployment in AI data centres.
Micas unveils 102.4T CPO switch
Tomahawk 6-based platform targets higher bandwidth density and power efficiency in next-generation AI data centres. Micas Networks has unveiled three 102.4Tbps Ethernet switch platforms based on Broadcom’s Tomahawk 6 technology, including a co-packaged optics (CPO) system designed for next-generation AI infrastructure.
ZEISS targets advanced packaging challenges
NLX enables non-destructive X-ray inspection, while DUNE measures and corrects wafer warpage. ZEISS Semiconductor Manufacturing Technology (SMT) is highlighting two solutions for advanced packaging at SEMICON West 2026, addressing inspection and wafer warpage challenges in increasingly complex chip architectures.
Marvell expands CXL memory for AI
New controllers target AI inference workloads with expanded memory capacity, PCIe Gen 6 connectivity and inline compression. Marvell has announced two second-generation CXL 3.2 memory expansion controllers designed to address growing memory demands in AI data centres. The Structera X 3406 and 3506 feature six DDR4 or DDR5 memory channels, a 50% increase over the previous generation, and PCIe Gen 6 connectivity.
Teradyne enhances Titan HP testing
New system targets reliability testing for high-power AI accelerators and other advanced semiconductor devices. Teradyne has introduced enhanced burn-in capabilities for its Titan HP platform, enabling manufacturers to combine reliability stress testing with system-level testing for high-power AI, automotive and other high-reliability semiconductor devices. Traditional burn-in processes use dedicated ovens to expose devices to controlled temperatures for extended periods before functional testing.
Evatec delivers first 310mm packaging tool
CLUSTERLINE 310 combines degas, etch and PVD processes for advanced packaging on small panel formats. Evatec has delivered its first CLUSTERLINE 310 system for panel-level advanced packaging on 310 × 310 mm panels to a leading global integrated device manufacturer (IDM). The system integrates degas, etch and physical vapour deposition (PVD) technologies to process glass and highly outgassing organic materials.
PHIX opens US photonic packaging facility
New Bozeman site expands US-based PIC packaging capacity and supports photonics commercialisation. PHIX has opened a new photonic packaging facility in Bozeman, Montana, expanding its US manufacturing presence and adding advanced packaging capabilities to the state’s growing photonics ecosystem.
Visitech targets 1 µm advanced packaging
The LLS1000 targets high-throughput maskless imaging for FOWLP, FOPLP and co-packaged optics. Visitech has launched its LLS1000, a 1 µm line/space photohead designed for maskless direct imaging in advanced packaging applications. The new photohead is intended to enable toolmakers to develop customised imaging systems for large-substrate packaging, with Visitech targeting more than 50 panels per hour for 515 × 510 mm panels and more than 100 wafers per hour.
GF to establish US silicon interposer supply
GlobalFoundries and TSMC have signed a multi-year $2 billion agreement to establish a US-based supply of silicon interposers for advanced AI packaging. GlobalFoundries (GF) will provide manufacturing services to TSMC and expand fabrication capacity at its Malta, New York facility to support TSMC’s CoWoS advanced packaging ecosystem.
Advanced packaging market set for growth
The global advanced packaging market is forecast to grow from $57.46 billion in 2026 to $90.11 billion by 2031, driven by chiplets, 3D integration and hybrid bonding. The global advanced packaging market is expected to reach $90.11 billion by 2031, up from an estimated $57.46 billion in 2026, according to a new report from Mordor Intelligence. The market is forecast to expand at a compound annual growth rate of 9.42% between 2026 and 2031.