Applied Materials Blog

SANTA CLARA, Calif., Sept. 21, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that members of its executive leadership team will participate in an Investor Breakfast Presentation during SEMICON West on Tuesday, Oct. 13, 2026. The presentation will begin at 8:00 a.m. PT and will conclude at approximately 10:30 a.m. PT. A live webcast will be available on the Applied Materials website at: https://ir.appliedmaterials.com with a replay available the same day.

SANTA CLARA, Calif., Aug. 27, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced the appointment of Akash Palkhiwala to serve on its board of directors. As Chief Financial Officer and Chief Operating Officer of Qualcomm Incorporated, Mr. Palkhiwala brings extensive financial and operational leadership experience in the computing and technology industry. Mr. Palkhiwala has also been appointed to the board’s Audit Committee.

SANTA CLARA, Calif., Aug. 14, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that members of its management team will participate in fireside chats at upcoming investor conferences. Brice Hill , Senior Vice President and CFO, will participate at the Citi 2026 Global TMT Conference on Tuesday, Sept. 8 beginning at 5:50 a.m. PT / 8:50 a.m. ET. Gary Dickerson , President and CEO, will participate at the Goldman Sachs Communacopia + Technology Conference on Wednesday, Sept.

Record revenue $9.12 billion, up 25 percent year over year GAAP gross margin 50.3 percent and non-GAAP gross margin 50.4 percent GAAP EPS $3.17 and record non-GAAP EPS $3.50, up 43 percent and 41 percent year over year, respectively EPIC Center R&D partnerships expand to 11 engagements with leading chipmakers, universities and innovation partners SANTA CLARA, Calif., Aug. 13, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc.

Collaboration pairs UC Berkeley’s semiconductor research strength with Applied’s state-of-the-art equipment and process integration expertise Located in Silicon Valley, Applied’s EPIC Center provides industry-scale R&D environment with access to cutting-edge chipmaking equipment to enable rapid co-innovation and faster commercialization SANTA CLARA, Calif., Aug. 11, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc.

SANTA CLARA, Calif., July 23, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that it will hold its fiscal third quarter 2026 earnings conference call on Thursday, Aug. 13, 2026, at 4:30 p.m. ET / 1:30 p.m. PT. The call will be webcast live at: https://ir.appliedmaterials.com. A replay will be available on the same day by 8:00 p.m. ET / 5:00 p.m. PT. About Applied Materials Applied Materials, Inc.

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logic New eBeam systems bring wafer-fab-grade metrology and defect...

SENZ will provide customers and partners with a co-optimized solution to bring high-performance augmented reality displays to market faster Groundbreaking technology will deliver world-class visual performance, seamless integration, and scalable manufacturing for next-generation smart glasses SANTA CLARA, Calif., June 17, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc.

Joint development agreement aims to accelerate commercialization of next-generation intelligent optical systems for smart eyewear and augmented reality (AR) optical lens stack Partnership combines world-class expertise in materials engineering, lenses and smart eyewear to develop lightweight, high-performance optical systems critical to scalable AR experiences PARIS and SANTA CLARA, Calif., June 16, 2026 (GLOBE NEWSWIRE) -- EssilorLuxottica and Applied Materials, Inc.

New systems enable precision materials engineering in high-aspect-ratio 3D logic and memory chip structures Centris™ Spectral™ SiN ALD leverages innovative microwave plasma technology to deliver uniform silicon nitride deposition in challenging 3D structures Producer™ Selectra™ Mo Etch selectively removes molybdenum for wordline separation to enable 3D NAND scaling The new systems are being used by leading logic and memory chipmakers for advanced node manufacturing SANTA CLARA, Calif., June...