BIS infotech

As satellite communications (SATCOM) continue to evolve with the rapid growth of Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) satellite constellations, defence organisations are facing increasing pressure to modernise their ground infrastructure. However, replacing entire ground networks is both expensive and operationally challenging.

u-blox has introduced two new Wi-Fi 6 module families—MAYA-W5 and NORA-W5—to simplify wireless connectivity for industrial and Internet of Things (IoT) applications. The new modules combine Wi-Fi 6 and Bluetooth Low Energy (Bluetooth LE) connectivity while helping developers reduce the complexity of RF design, certification, and wireless integration.

TAIYO YUDEN has launched two new series of advanced capacitors designed to meet the heavy power demands of modern, high-tech vehicles. The new HVX (-K) and HTX (-K) series are conductive polymer hybrid aluminum electrolytic capacitors. These small but crucial components are built to handle high-voltage power supplies, making them ideal for the next generation of cars.

Meta Platforms is preparing to begin manufacturing its next-generation artificial intelligence (AI) chip, code-named “Iris,” from September as part of its broader strategy to strengthen its AI infrastructure and reduce reliance on external chip suppliers. The new chip is expected to play a key role in supporting Meta’s growing AI workloads across platforms such as Facebook and Instagram.

DigiTech ASEAN Thailand & AI Connect 2026, the premier international exhibition and business networking platform for digital business solutions, is making a grand return. The event will take place from 25 to 27 November 2026 at Hall 7-8, IMPACT Exhibition & Convention Center, Bangkok, Thailand With a focus on helping businesses navigate today’s economic challenges and rapid technological shifts, this year’s event has expanded its exhibition space.

Flex Power Modules has introduced the BMR353, a next-generation high-power DC/DC intermediate bus converter (IBC) engineered for the demanding power requirements of AI data centers. The non-isolated eighth-brick IBC delivers a fully regulated 12.2 V output from a 40-60 V input, providing 860 W of continuous power (72 A) with a peak capability of up to 1,200 W (100 A).

The adoption of Artificial Intelligence (AI) across industries worldwide can help strengthen India’s semiconductor vision, enabling the country to transition from being largely dependent on semiconductor imports to becoming a global leader in semiconductor design and manufacturing.

Infineon Technologies AG is launching the SECORA™ ID Key S USB, a Java Card™-based solution with USB and NFC connectivity for secured authentication and digital signatures. As the first FIDO-certified Level 3+ solution and compliant with CTAP 2.1, the authenticator enables phishing-resistant, passwordless authentication as well as protection against remote software and local hardware attacks.

Polymatech Electronics Limited has announce that the Ministry of Commerce and Industry, Department of Commerce, Government of India, has notified Polymatech’s Special Economic Zone for the manufacturing of semiconductors and electronic components at Mandir Hasaud, Nava Raipur, Atal Nagar, Chhattisgarh. The notification, issued as S.O. 3675(E) and published in the Gazette of India, notifies 10.13 hectares of land comprising Plot Nos. 17/A, 17/B and 16/1A for the Special Economic Zone.

As the global semiconductor industry enters a new phase in 2026, driven by the rapid expansion of AI infrastructure, the semiconductor testing and validation market has become more critical than ever. Due to the small size (below 3nm) of the chips and the use of sophisticated packaging technology, testing has now moved from being a part of the end process to being an absolutely necessary requirement in order to deliver quality performance and reduce time-to-market.