Designing Electronics North America
Magazine
Launched in May 2022, Designing Electronics North America is a bi-monthly Print magazine specifically for electronics design engineers and other professionals who are responsible for designing the newest and latest products in North America. Our brand-new circulation built in 2022 provides a minimum 20,000 print circulation plus an additional 126,000 digital editions delivery per issue. Over the last 17 years, MMG has built a strong reputation for circulation excellence and freshness and DENA receives the same blueprint investment and strategy to ensure we have the best targeted circulation available. Source
Actions
Media Outlet details
| Scope | N/A |
|---|---|
| Language | English |
| Country | United States of America |
|
Similarweb UVM |
Request pricing |
|
Comscore UVM |
Request pricing |
Recent Articles
Search ArticlesNordic Semiconductor continues nRF54L Series expansion with new multiprotocol SoC for size- and cost-effective IoT devices
A single device for tags, trackers, and smart home sensors, with Bluetooth LE, Thread, and Zigbee support, advanced security features, and enhanced energy efficiency. Oslo, Norway, September 15, 2026 – Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today unveils the nRF54LC10A System-on-Chip (SoC), supporting Bluetooth® Low Energy (LE), Bluetooth Channel Sounding, Thread, Zigbee, and Matter.
Aluminum Electrolytic Capacitors TDK expands ultra-compact snap-in capacitor series for AI servers and raises the voltage rating to 500 V
TDK Corporation (TSE:6762) has expanded its B43645, B43657, B43658, B43659, B43660, and B43661 series of ultra-compact snap-in aluminum electrolytic capacitors to meet the specific needs of advanced AI server power supply units (PSUs) and high-performance SMPS applications. Additionally, the rated DC voltages were raised to 500 V.
TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures
TDK Corporation (TSE:6762) launches the TDK-Lambda TPF12500-385 series of non-isolated three-phase power supplies delivering up to 13.1 kW, with a nominal rating of 12.5 kW. With a regulated output voltage of 385 Vdc and an efficiency of 97.5 %, the series is designed for Distributed Power Architectures (DPA) and is capable of providing power to isolated high voltage DC-DC converters or DC Microgrids.
Aerospace-grade thin-film substrates
In military and aerospace systems, thin-film patterned substrates serve as the foundation of some of the most critical electronic assemblies, including RF, microwave, millimeter-wave, and high-speed digital circuits. These substrates are typically made by depositing extremely thin layers of conductive and dielectric materials on bases (substrates) made from materials such as alumina, aluminum nitride, quartz, or certain high-performance titanates with dielectric constants up to k = 4000.
The upgrade problem hidden inside today’s aerospace designs
The sensors, processors, communications systems, and electronic capabilities available today will almost certainly be replaced, expanded, or upgraded during a platform’s service life. Yet many programs still make electrical architecture decisions as though today’s configuration will remain largely unchanged. From our perspective in the aerospace and defense component market, one lesson has become clear: integrating the first generation of a new technology is rarely the hardest part.
SiPearl delivers the first Rhea1 CPUs to Bull for integration into JUPITER, Europe’s fastest operating supercomputer
SiPearl, the fabless designer of European high-performance energy-efficient CPUs built for sovereign supercomputing, AI and data centre, has delivered the first samples of Rhea1 to Bull, a leader in advanced computing and AI. This turning point marks a major milestone. It illustrates Europe’s success in asserting its technological sovereignty in advanced computing and AI, as Rhea1 will become the first European-designed CPU deployed in a European-built platform.
Reliability by design
Semiconductors engineered for demanding automotive applications By Patrick Kwok, Technical Responsible for Business Development at Diotec Semiconductor Americas “Automotive Power” today extends far beyond traditional motor control and drive electronics.
Ambarella and Macnica Enter a Long-Term Strategic Distribution Agreement to Accelerate Edge AI Infrastructure and Physical AI Adoption
Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that it has entered into a long-term strategic distribution agreement with Macnica Americas, Inc. and Macnica ATD Europe S.A.S. (collectively, “Macnica”) to expand the availability and adoption of Ambarella’s edge AI infrastructure products and solutions across the Americas and EMEA.
Arrow Electronics enables early evaluation of NXP’s Ara240 Edge AI Accelerator
Arrow Electronics has announced global access is now available for customers to remotely evaluate NXP® Semiconductors’ Ara240 discrete neural processing unit (DNPU) via their Digital Test Drive capability. This gives engineers early access to advanced AI models and technologies for computer vision, generative AI and multimodal systems, allowing them to assess performance and initiate designs ahead of investing in their own hardware.
Specify Award-Winning CONTROL-KNOBS Customized and ‘Production Line Ready’
OKW’s award-winning CONTROL-KNOBS for rotary potentiometers and encoders can now be specified customized and ‘production line ready’. These ergonomic knobs, which won an iF DESIGN AWARD, are ideal for touch/click functions on menu-driven interfaces. Applications include measurement and control, medical/wellness, laboratory equipment, HVAC, communications, building control systems and Smart Factory technology.