Designing Electronics North America

TDK Corporation (TSE:6762) introduces the E13 EM series (ordering code: B8280*F*). These IGBT/FET gate drive transformers are designed for automotive 500-V battery systems, enabling reliable isolation in traction inverters and compact DC-DC converters. By meeting stringent creepage and clearance requirements, this new series supports safe and efficient power conversion in xEV platforms, where robust insulation and space-efficient design are crucial to next-generation electrified mobility.

Over the past two years, chiplets have evolved from a promising architectural approach to an established one in leading-edge silicon. Major AI accelerators, server processors, and client platforms now use multi-die designs to meet performance, bandwidth, and packaging targets that are increasingly difficult to reach with a single large monolithic die.

Closing the loop between AI and hardware AI coding assistants are rapidly becoming part of the embedded engineer’s toolkit. Ask one of today’s large language models to write a device driver, initialize a peripheral, or configure a communication interface, and there’s a good chance it will produce something that at least looks plausible. The problem, of course, is that embedded development doesn’t happen on a screen—it happens on real hardware. This is where Embedder takes a different approach.

By Chris Morrison, VP Product Marketing at Agile Analog In the current semiconductor landscape, security threats are scaling with the explosion of connected devices and Edge AI. Billions of SoCs that power everything from automotive ECUs to industrial IoT process sensitive data, often in untrusted environments. As the complexity and range of security attack techniques have risen, tamper detection and prevention have become a hot topic.

Why LPDDR demands a new module approach AI workloads are placing unprecedented demands on modern data centers, and memory is quickly becoming a primary constraint and a key driver of performance and total cost of ownership. While processors and accelerators continue to scale, power efficiency, signal integrity, and thermal limits are increasingly dictated by the memory subsystem.

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new web-based RF engineering tool — the Antenna Integrator Studio. Wireless connectivity has become a ubiquitous capability for electronic products extending throughout every industry. As such, RF engineering has become an essential element of most electronic product designs.

SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has expanded its QSiC™ Dual3 family of half-bridge MOSFET modules – adding high-thermal-performance options with AlN (aluminum nitride) substrates and pre-applied TIM (thermal interface material), as well as new 1700 V devices.

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, highlights its comprehensive LoRa®resource center as global adoption of low-power, wide-area IoT networks accelerates. Engineers designing network infrastructure, industrial automation, and smart-sensing applications can access the latest technologies and design insights to shape next-generation wireless connectivity.

Bourns has introduced the CDSOD323-TxxC-Q Series, an automotive-grade transient voltage suppressor (TVS) diode designed to protect single data lines or I/O ports from ESD and surge events. The series combines bidirectional protection with low typical capacitance in a compact JEDEC SOD-323 package to support high-speed signal integrity in space-constrained designs.

Stackpole Electronics, Inc. announces the release of its new RMHT automotive-grade thick film chip resistors, designed for harsh-environment applications requiring stable full-power operation at temperatures up to 105°C. Unlike most thick film chip resistors that must be derated above 70°C, RMHT is engineered to maintain reliable performance in demanding automotive, industrial, construction, and commercial electronic systems.