Designing Electronics North America

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new web-based RF engineering tool — the Antenna Integrator Studio. Wireless connectivity has become a ubiquitous capability for electronic products extending throughout every industry. As such, RF engineering has become an essential element of most electronic product designs.

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, highlights its comprehensive LoRa®resource center as global adoption of low-power, wide-area IoT networks accelerates. Engineers designing network infrastructure, industrial automation, and smart-sensing applications can access the latest technologies and design insights to shape next-generation wireless connectivity.

SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has expanded its QSiC™ Dual3 family of half-bridge MOSFET modules – adding high-thermal-performance options with AlN (aluminum nitride) substrates and pre-applied TIM (thermal interface material), as well as new 1700 V devices.

Stackpole Electronics, Inc. announces the release of its new RMHT automotive-grade thick film chip resistors, designed for harsh-environment applications requiring stable full-power operation at temperatures up to 105°C. Unlike most thick film chip resistors that must be derated above 70°C, RMHT is engineered to maintain reliable performance in demanding automotive, industrial, construction, and commercial electronic systems.

Bourns has introduced the CDSOD323-TxxC-Q Series, an automotive-grade transient voltage suppressor (TVS) diode designed to protect single data lines or I/O ports from ESD and surge events. The series combines bidirectional protection with low typical capacitance in a compact JEDEC SOD-323 package to support high-speed signal integrity in space-constrained designs.

Vox Power is extending its NEVO+ series output module range by adding digital control capability with a PMBus™ 1.2 compatible interface, enabling seamless integration into embedded systems via I²C.

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is exhibiting at IMS 2026, also known as the IEEE International Microwave Theory Symposia, which is taking place this week — Sunday, June 7, through Friday, June 12 — in Boston.

Menlo Microsystems Inc. (Menlo Micro), a leader in high-performance switching solutions, today announced the industry’s first broadband RF switching platform that covers DC to 70 GHz, which extends switching performance into the bandwidths required for high-frequency silicon photonics test systems, where traditional switching technologies face significant performance limitations.

The DTCD and DTCJ 1.27 mm pitch DIP switches are ultra-miniature SMD components designed for high-density electronic applications. With a low-profile height of just 2.2 mm and up to 46% PCB space savings compared to traditional 2.54 mm solutions, they enable significant footprint reduction without compromising functionality. Available in Gullwing and J-bend terminations, both versions are optimized for automated SMT assembly, reducing manufacturing complexity and cost.

EV power systems in battery electric and hybrid vehicles are rapidly advancing toward higher system voltages to support greater efficiency and increased power delivery. In these demanding applications, busbar shunts offer a highly reliable, accurate, and cost-effective solution for current measurement across the vehicle’s high current subsystems.