EE Journal

Lightpath today announced new fiber builds to support two hyperscale data center campuses now under construction, extending its AI-grade network to meet surging capacity demand driven by artificial intelligence. Each campus is planned to exceed one gigawatt of capacity. Lightpath will provide triverse fiber infrastructure and multi-terabit capacity to the two facilities, located in Saline, Michigan and Port Washington, Wisconsin.

DeepInfra, a purpose-built cloud platform for high-throughput AI inference, today announced the opening of a new data center location in Toronto. Global AI infrastructure demand is increasingly being driven by inference workloads as enterprises shift from model training to production-scale deployment.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will supply CoolSiC™ MOSFETs 1200 V and matching dual-channel EiceDRIVER™ 2EDB9259Y gate drivers to ADVANTICS, a technology leader in silicon carbide (SiC) power electronics and advanced control systems, for its new line of liquid-cooled power converters.

Close your eyes and imagine the following scene. No. That won’t work, will it? Let’s try doing this a different way. Keep your eyes open and imagine they’re closed. Visualize a future timeline where you use a GUI to drag-and-drop chiplets onto an active silicon substrate, run simulations and profiling, fine-tune your design, pick a package type, assign package pins, press the “Go” button, then sit back and wait for your new masterpiece to arrive back from the foundry.

Virginia Fiber Express Networks LLC (VFE Networks), a wholly owned subsidiary of Infraforward Strategies LLC, announces the successful securing of Competitive Local Exchange Carrier (CLEC) and Interexchange Carrier (IXC) operating licenses and Land Use permit from the Commonwealth of Virginia. Having achieved these milestones, VFE Networks, in collaboration with its Virginia-based partners Express Technologies Inc.

Tuxera announces its physical AI data layer strategy, helping manufacturers prepare for the emerging€430 billion Physical AI market (Strategy&, PwC, 2026). By applying its proven storage, flash management, networking and safety-certified technologies to physical AI, the company is helping customers build the resilient data infrastructure needed to deploy intelligent systems with confidence. Physical AI represents the next evolution of artificial intelligence.

Plasma jets, in which ionized gas is emitted from a source in the form of a focused, highly dynamic, light emitting structure, play a central role in numerous technological and medical applications, ranging from materials processing to plasma medicine. At the same time, plasma discharges are among the phenomena that are most difficult to study experimentally: They are small-scale, highly dynamic, erratic, and change within a few microseconds.

As the global DRAM shortage enters a critical phase, driven by insatiable AI data center demand consuming upwards of 70% of worldwide memory production, frame grabber manufacturers dependent on onboard DDR4 memory are facing lead times exceeding 20–30 weeks, allocation rationing, and, in many cases, complete product unavailability. BitFlow, Inc., a division of Advantech, is not one of them. BitFlow’s entire product line, including the Axion, Aon, Claxon, and Cyton series, is shipping now.

Portwell, Inc., a global innovator in industrial and embedded computing  solutions, announced the launch of PCOM-B65C, a high-performance COM Express® Type 6 Compact module  powered by the NPU-integrated AMD Ryzen™ Embedded 8000 Series processors. Designed in compliance with the  PICMG COM Express® R3.1 specification, PCOM-B65C combines robust computing, graphics, and AI acceleration  with integrated Out-of-Band (OOB) remote management in a compact 95 x 95 mm form factor.

Anglia Components, one of Europe’s longest-established, independent, authorised distributors of electronic components, has signed a distribution deal with 3PEAK Incorporated, semiconductor company focusing on high-performance, high-quality, and highly reliable ICs, including signal chain, power management, and mixed-signal front-ends.