EE Times India

Article By : International Data Corp. India's tablet market shipped 1.1 million units in the second quarter, up by 3.4% YoY, according to the latest data from IDC. India’s tablet market (inclusive of detachable and slate tablets) shipped 1.1 million units in the second quarter (2Q 2026), up by 3.4% year-over-year (YoY), according to the latest data from the International Data Corp. (IDC) Worldwide Quarterly Personal Computing Device Tracker.

India’s National Institute of Electronics and Information Technology (NIELIT) and Intel India have launched an Agentic AI skilling initiative designed to prepare students, educators and professionals for increasingly autonomous AI systems. The initiative was introduced during a National Leadership Dialogue on “Preparing the Future Workforce for the Agentic AI Era” in New Delhi.

Silicon Motion Technology’s MonTitan SSD Reference Design Kit (RDK) is targeted at enterprise storage requirements emerging from Agentic AI infrastructure. Unveiled at FMS2026, the platform incorporates Silicon Motion’s next-generation PerformaShape technology and is designed to help enterprise SSDs function as a persistent memory layer.

As the use of AI for anomaly detection, predictive maintenance, and autonomous control continues to expand, understanding the importance of communication quality has become increasingly essential for maximizing the performance of AIoT systems. This white paper outlines key AIoT applications, explains the impact of communication quality on AI analysis and decision-making, highlights the challenges of communication quality evaluation, and introduces Anritsu solutions to address these challenges.

Marelli and Microchip Technology Inc. have demonstrated an open-standard automotive display connectivity solution designed to support the transition toward centralized computing and software-defined vehicles (SDVs). The solution uses ASA Motion Link (ASA-ML), an open standard for automotive video connectivity and serializer-deserializer (SerDes) communication defined by the Automotive SerDes Alliance (ASA).

India’s Ministry of Electronics and Information Technology (MeitY) has notified the INR62,500 crore (around $6.6 billion) Mobile Phone Manufacturing Scheme (MPMS), replacing the recently concluded Production Linked Incentive program for large-scale electronics manufacturing and aiming to deepen domestic value addition across the country’s mobile supply chain.

India has issued notifications covering all six pillars of its Semicon 2.0 program, expanding government support across the semiconductor value chain as the country seeks to strengthen its design and manufacturing ecosystem. Union Minister for Electronics and Information Technology, Railways and Information & Broadcasting Ashwini Vaishnaw outlined the next phase of India’s semiconductor strategy, which builds on the first Semicon India Program.

Texas Instruments has introduced the TCAN6062, which it describes as the industry’s first commercially available CAN XL transceiver, targeting industrial systems facing increasing data and communication requirements. The device supports CAN XL payloads of up to 2,048 bytes per frame and data rates reaching 20Mbps.

Article By : Quectel Wireless Solutions Quectel expands its RG660Qx 5G module platform with FRMCS support to accelerate railway communications testing and migration. Quectel Wireless Solutions Co. Ltd has introduced an LGA version of its RG660Qx 5G module series with support for the Future Railway Mobile Communication System (FRMCS), giving railway equipment manufacturers an early platform for evaluating next-generation 5G-based communications.

India’s semiconductor ambitions have moved rapidly from policy announcements toward physical manufacturing. New fabs, packaging facilities, electronics clusters and design initiatives are beginning to establish the foundations of a domestic semiconductor industry. But building a globally competitive ecosystem will require more than manufacturing capacity.