Electronics Cooling

Introduction As single-component heat dissipations in electronics cooling are increasing, air cooling is not always up to the task and is being replaced by liquid cooling. Key differences between air cooling and liquid cooling are a much higher heat transfer coefficient, higher pressure drop and much lower fluid heating. This article investigates the use of correlations to get some quick ballpark estimations of heat transfer coefficient and pressure drop.

The rapid rise of AI accelerators and high-performance computing has pushed rack power densities to unprecedented levels. While direct-to-chip liquid cooling successfully manages heat at the processor, the power delivery path itself has emerged as the next critical thermal bottleneck.

The GTP thermal pad is an advanced graphene thermal conductive gasket developed for high-end electronics and precision optical equipment. It combines ultra-high thermal conductivity with stable interface performance, helping fill tiny gaps between heat sources and heat sinks to improve heat-transfer efficiency in compact assemblies. Features Thermal Conductivity: 75.0W/mk Excellent flexibility, resilience and thermal stability.

The Full Data Center Cooling Days 2026 Program is Available to Stream Over the past two weeks, engineers from across data center thermal management came together to share practical engineering presentations on liquid cooling, AI infrastructure, coolant management, thermal testing, and more. If you couldn’t attend live or missed one of the sessions, you can watch the free two-day program that aired on July 15 & 22, 2026.

As consumer electronics continue their rapid evolution, each new generation is defined by a familiar yet intensifying mandate: deliver more performance in less space. Today’s devices — whether smartphones, wearables, or portable computing platforms — are expected to be thinner, lighter, and more power-efficient, while simultaneously supporting increasingly demanding workloads such as high-speed connectivity, immersive media, and on-device artificial intelligence.

ABSTRACT Power densities continue to increase in AI servers, high-performance computing (HPC) systems, electric vehicles, and semiconductor manufacturing equipment. As a result, thermal management has become a critical system-design requirement. Thermal solutions often fall short not because one material lacks performance, but because the complete thermal path has not been engineered as a system.

A misconception that experienced thermal engineers have likely encountered is related to the improper use of Theta JA (θJA) of an electronic component. Many electrical and reliability engineers are taught that the junction temperature of an electronic component in any electronics packaging configuration or application may be calculated by the equation below.

Save your spot now for a brand new virtual event from Thermal Live and Electronics Cooling: Data Center Cooling Day 2026 (DCC ’26), live on July 15. We developed this event to give thermal, mechanical, facility, and data center systems engineers a focused and convenient space to explore the cooling methods and technologies currently driving high-density data center design.

The SEMI-THERM 42 Symposium was held March 9-12, 2026 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Dr. Navid Kazem (Arieca), Program Chair Dr. Claire Wemp (Qnity), and Program Vice Chair Dr. Mohamed Abo-Ras (Nanotest). It featured technical short courses, technical sessions, invited presentations, vendor exhibits and workshops, a panel discussion, and a luncheon talk. Short courses Four short courses were held on Monday, March 10.

The hidden hardware helping AI’s heat problem If it feels like the semiconductor market is suddenly back in the headlines, that’s because it is. ASML, the world’s leading supplier of photolithography systems, recently reported that its shares have risen around 97 per cent over the past six months, reflecting renewed investment in chip production.