Electronics Cooling

High-density AI racks no longer fail one signal at a time. Workload, flow, pressure, coolant chemistry, and facility heat rejection now move together. Thermal engineers need an orchestration layer that connects those signals to the heat-transfer and hydraulic models behind the cooling design. The Failure Pattern A modern AI rack does not fail like a light switch. It starts as a disagreement between systems. Graphics processing unit (GPU) telemetry says that the job is still running.

Save your spot for Thermal Live Fall 2026, live October 14–15. Electronics Cooling’s flagship virtual event returns for two days of technical presentations and product demonstrations focused on the thermal management challenges engineers are facing today. Register for Thermal Live Fall 2026 Thermal Live brings together engineers, designers, and industry experts to share practical approaches to cooling, thermal design, testing, materials, and system performance across a wide range of applications.

This past winter, many of us in the United States lived through a Polar Vortex. For anyone who is not familiar with the term, a Polar Vortex is a weather pattern made up of very cold temperatures, high winds, and frenzied TV weather forecasters who are beside themselves in enthusiastically explaining to the viewers how historically cold this particular weather system is. Inevitably, these forecasters describe the combination of cold temperatures and high winds in terms of the ‘wind chill factor’.

A $5.5 million investment more than doubles U.S. thermoelectric cooler production space, with over 5,300 sq. ft. dedicated to manufacturing and R&D to support growing demand across optoelectronics, sensor system and other high-growth markets.

The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 26–29, 2026. This was the 25th ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule, so ITherm 2026 marked the series’ 25th conference in its 38-year history.

Evaluating thermal management materials for modern electronic applications goes far beyond picking a product from a catalog. Recently, an electronics manufacturer operating in Vietnam engaged T-Global to navigate the entire evaluation process for a new device. The company needed support in identifying a suitable solution based on strict application specifications. Modern electronics pack more functionality into smaller footprints.

As electronics manufacturing continues to expand across Vietnam and Southeast Asia, regional production teams are placing greater demands on suppliers to respond quickly, support customization, and maintain reliable delivery from development through mass production. For one electronics manufacturing customer operating in the region, thermal management support had become a point of friction.

As direct-to-chip liquid cooling moves from pilot projects to larger AI and high-performance computing deployments, maintaining coolant health is becoming an increasingly important part of the thermal reliability equation. Beyond selecting a fluid with the right thermal properties, engineering teams must consider coolant chemistry, system commissioning, sampling and testing, and how fluid condition is managed throughout the life of the cooling system.

Introduction As single-component heat dissipations in electronics cooling are increasing, air cooling is not always up to the task and is being replaced by liquid cooling. Key differences between air cooling and liquid cooling are a much higher heat transfer coefficient, higher pressure drop and much lower fluid heating. This article investigates the use of correlations to get some quick ballpark estimations of heat transfer coefficient and pressure drop.

The rapid rise of AI accelerators and high-performance computing has pushed rack power densities to unprecedented levels. While direct-to-chip liquid cooling successfully manages heat at the processor, the power delivery path itself has emerged as the next critical thermal bottleneck.