Electronics Cooling

ABSTRACT Power densities continue to increase in AI servers, high-performance computing (HPC) systems, electric vehicles, and semiconductor manufacturing equipment. As a result, thermal management has become a critical system-design requirement. Thermal solutions often fall short not because one material lacks performance, but because the complete thermal path has not been engineered as a system.

A misconception that experienced thermal engineers have likely encountered is related to the improper use of Theta JA (θJA) of an electronic component. Many electrical and reliability engineers are taught that the junction temperature of an electronic component in any electronics packaging configuration or application may be calculated by the equation below.

Save your spot now for a brand new virtual event from Thermal Live and Electronics Cooling: Data Center Cooling Day 2026 (DCC ’26), live on July 15. We developed this event to give thermal, mechanical, facility, and data center systems engineers a focused and convenient space to explore the cooling methods and technologies currently driving high-density data center design.

The SEMI-THERM 42 Symposium was held March 9-12, 2026 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Dr. Navid Kazem (Arieca), Program Chair Dr. Claire Wemp (Qnity), and Program Vice Chair Dr. Mohamed Abo-Ras (Nanotest). It featured technical short courses, technical sessions, invited presentations, vendor exhibits and workshops, a panel discussion, and a luncheon talk. Short courses Four short courses were held on Monday, March 10.

The hidden hardware helping AI’s heat problem If it feels like the semiconductor market is suddenly back in the headlines, that’s because it is. ASML, the world’s leading supplier of photolithography systems, recently reported that its shares have risen around 97 per cent over the past six months, reflecting renewed investment in chip production.

Executive Summary Thermal management is becoming a defining factor in system performance across advanced electronics. Demand is accelerating in AI and high-performance computing, data center infrastructure, electric vehicles, semiconductors, industrial systems, and other high-reliability applications, where increasing power density and extended operating cycles place sustained stress on thermal solutions.

MIDLAND, Mich. — May 18, 2026 — Dow (NYSE: DOW) today announced the launch of Dow Coolant Care Network, an end-to–end service model designed to help data center operators protect uptime, reduce operational risk, and confidently manage direct-to-chip liquid cooled systems using DOWFROST™ LC and DOWFROST™ HD Heat Transfer Fluids.

New large–diameter hoses open access to more applications—supporting higher flow rates and improving installation efficiency across cooling loops. DENVER, May 11, 2026 — Gates Corporation (NYSE: GTES), a global manufacturer of innovative, highly engineered power transmission and fluid power solutions, is expanding its Data Master MegaFlex hose portfolio with new 3-inch and 4-inch inner diameter options.

Registration is open for Thermal Live Spring 2026 Join Electronics Cooling on May 19 for a day of technical sessions and product demos focused on real-world thermal challenges. Register Now Thermal Live Spring 2026 brings together hundreds of engineers and technology leaders to share practical insight into the latest advances in cooling, materials, and system design.

Abstract With increasingly strict regulations on lithium-ion battery (LIB) thermal runaway (TR) and safety, rapid detection has become essential to ensure passengers can evacuate safely in electric vehicles (EVs). Early TR detection requires temperature sensors to monitor battery behavior. Incorporating many sensors increases both cost and system complexity, so commercial batteries often rely on a limited number of them, which can delay TR detection.