Electronics-Lab

Waveshare ESP32-C5-MINI-KIT is a compact development board based on the Espressif ESP32-C5-MINI-1 module. With a 32-bit RISC-V single-core processor clocked up to 240 MHz, the board adds dual-band (2.4 GHz and 5 GHz) Wi-Fi 6, Bluetooth 5.0 LE, and IEEE 802.15.4 (Zigbee 3.0 and Thread) connectivity for smart home and industrial automation applications. The ESP32-C5-MINI-KIT comes with 4MB of onboard Flash, 384KB of HP SRAM, and 320KB of ROM.

A new companion IC keeps host processors asleep until sensor data warrants attention, extending battery life in IoT devices. IoT Power Sensors 15 hours ago by Electronics-Lab Staff Battery life increasingly determines which edge designs succeed and which stall out in the field.

The compact Sige6 delivers 4K video, Wi-Fi 6, NVMe expansion, rich I/O, and up to 16GB LPDDR5 for edge AI and embedded applications. ArmSoM Sige6 Allwinner A733 SBC The Sige6 Allwinner A733 SBC from ArmSoM combines an octa-core Allwinner A733 processor with AI acceleration, high-speed memory, wireless connectivity, and extensive I/O in a compact single-board computer.

LattePanda Mu A380 MXM GPU Carrier Board Kit The LattePanda Mu Carrier Board A380 MXM GPU Kit combines compact x86 computing with discrete graphics acceleration for edge applications that need more than integrated graphics can provide. The kit pairs a LattePanda Mu compute module with an Intel Arc A380 MXM graphics card, creating a small platform for local AI inference, digital signage, machine vision, and multi-display systems.

Built around Qualcomm Dragonwing IQ-9075, the module combines 36GB LPDDR5, 128GB UFS, dual 2.5GbE, PCIe Gen4, and extensive I/O for edge AI. Embedded and Edge Interface IoT September 7, 2026 by Sayantan Nandy Radxa VMARC-Q9075 Qualcomm Dragonwing compute module Radxa has expanded its embedded portfolio with the VMARC-Q9075, a high-performance Qualcomm Dragonwing compute module built around the Dragonwing IQ-9075 platform.

Two new fourth-generation transceivers round out a portfolio spanning sub-GHz sensors to satellite-connected, multi-band tracking devices. ICs IoT RF / Wireless September 4, 2026 by Electronics-Lab Staff Semtech has moved two additions to its LoRa Plus transceiver family into production.

Seeed Studio’s Wio-S3 is a compact wireless module that combines an ESP32-S3R8 dual-core MCU with a Semtech SX1262 LoRa transceiver for long-range IoT connectivity. It supports LoRaWAN on the EU868 and US915 frequency bands, along with 2.4 GHz Wi-Fi and Bluetooth 5.0, making it suitable for smart agriculture, industrial automation, remote monitoring, and other connected applications. The module features a dual-core ESP32-S3 processor with 16MB Flash and 8MB PSRAM for data processing and edge AI.

Espressif's new M.2 Radio Co-Processor has officially received certification from the Wi-Fi Alliance, accompanied by an initial release of open-source software support. IoT RF / Wireless September 3, 2026 by Debashis Das The ESP32-E22 was first introduced at CES 2026 back in January with a dual-core RISC-V processor clocked at up to 500 MHz, 1MB RAM, tri-band Wi-Fi 6E, and dual-mode Bluetooth 5.4 connectivity co-processor designed for host-based wireless systems.

A new double-sided packaging method embeds resistors, capacitors, and inductors alongside active dies, cutting footprint by roughly 80 percent. Analog Components Semiconductors September 2, 2026 by Electronics-Lab Staff Nisshinbo Micro Devices has unveiled Silicon Motherboard (Si-MB®), a three-dimensional packaging approach the company says is the first to place functional circuitry on both faces of a silicon substrate.

rCore-Q6490 Energy-Efficient Edge AI SoM Radxa has introduced the rCore-Q6490, an Energy-Efficient Edge AI SoM built around the Qualcomm Dragonwing QCS6490 platform. The compact system-on-module combines an 8-core Kryo 670 CPU, Adreno 643 GPU, and Hexagon 770 AI Engine in a 42 × 36 mm form factor. Its 12 Dense TOPS AI performance makes it suitable for intelligent embedded systems that need strong on-device computing without relying entirely on cloud processing.