Electronic Specifier

ROHM has developed a new line up of 600V Super Junction MOSFETs, the R60xxXNx and R60xxWNx series. In the data centre and industrial equipment fields, power demand continues to increase as processing loads grow, driving strong demand for higher power supply efficiency to reduce both power consumption and heat generation. At the same time, as applications become smaller, power supply circuits must achieve higher power density and space savings while delivering higher output within limited space.

The public debate on artificial intelligence tends to focus on models, parameters, and use cases. At GITEX AI Europe 2026 (Messe Berlin, 30th June – 1st July 2026), the Würth Elektronik eiSos Group shifted attention to a more fundamental question: Is the physical infrastructure sufficient to meet these expectations? On stage, Alexander Gerfer, Chief Technology Officer (CTO) of the group, discussed with moderator Massimo Marioni, form Fortune Editor, where the real limits to scaling lie.

Toshiba Electronics Europe GmbH introduces TDS5B212MX and TDS5C212MX, multiplexer/demultiplexer switches for high-speed differential signals. Suitable for servers, industrial testers, robots, and related applications, the new products support high-speed interfaces such as PCIe 6.0 and USB4 Version 2.0. The devices use Toshiba’s proprietary SOI process (TarfSOI) to achieve a typical -3dB differential bandwidth of 29GHz for TDS5B212MX and 34GHz for TDS5C212MX.

Electronic Specifier caught up with Rohde & Schwarz at Hardware Pioneers Max in London recently, speaking to two specialists about the trends shaping EMC testing and oscilloscope design, and the products the company is bringing to market to address them. Nathan Reeve, EMC Product Specialist at Rohde & Schwarz UK, described a shift in how manufacturers approach compliance work.

For design teams adopting 3D IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate heat, and navigate the intricate dance of physics within these stacked architectures? While 3D ICs offer significant advantages in size, performance, power efficiency, and cost, they also introduce a new level of complexity.

Nowadays, nanotechnology permeates almost every facet of modern technology. Go large or go home is out; go small to rule them all is in – not really, but size in tech matters now more than ever. And, it turns out, the smaller the better. A nanometre is a unit of measurement so infinitesimally small that materials manipulated at this scale start to show quantum effects. But long before scientists theorised it and turned it into a bona fide, useful field of technology, it was already being put to use.

Designing isolated DC/DC converters has long required engineers to strike a balance between flexibility and development effort. Off-the-shelf converter modules reduce design time but often limit optimisation in terms of efficiency, board space, or cost. Fully discrete designs, on the other hand, offer maximum design freedom while significantly increasing engineering complexity.

Software-defined vehicles (SDVs) rely on deterministic, high-bandwidth communication to support advanced driver assistance, centralised compute architectures, and over-the-air (OTA) updates. SDV zonal architectures implement automotive Ethernet as the backbone interconnect for these functions, linking domain controllers, gateways, high-performance compute platforms, and switches. Today, high-data-rate cameras (Fig.

Electronic Specifier has released its July issue, bringing together the latest developments in physical AI security, test and measurement, robotics, power, and the memory market, alongside features celebrating the people driving innovation across the electronics sector.

Allegro MicroSystems introduced the A81415, the industry’s first ASIL-D-certified Power Management IC (PMIC) to integrate a wheel-speed sensor interface. The new device provides electromechanical braking (EMB) designers with a substantially simplified, single-chip power and sensing foundation for next-generation brake-by-wire systems. Brake-by-wire is fast becoming a foundational chassis technology in software-defined vehicles.