EP&T Magazine
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EP&T (Electronic Products and Technology) is Canada’s definitive provider of news, new products, trends and information serving the electronics engineering and designer OEM & MRO markets. Source
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| Scope | National, Trade/B2B |
|---|---|
| Language | English |
| Country | Canada |
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| Frequency | Other |
Recent Articles
Search ArticlesNon-isolated dc-dc bus converters boost power, efficiency
OMNION POWER Osprey Bus series non-isolated dc-dc bus converters offer high power and high efficiency to support 12Vdc intermediate bus applications that require tight regulation. The converters feature a wide 40 to 60Vdc input voltage range and industry-standard, modified DOSA digital quarter-brick footprints.
Lyft opens Toronto technology hub
New 90,000-square-foot office at First Canadian Place will support engineering, product development and AI-driven mobility innovation Lyft has opened a new technology hub in downtown Toronto, expanding its Canadian operations and establishing the ride-hailing company’s second-largest technology hub in North America after San Francisco. Located at First Canadian Place, the 90,000-square-foot office is expected to create more than 500 high-skilled jobs in Ontario.
Agentic AI assistant helps develop, optimize, debug, deploy designs
AMD Ross agentic AI assistant spans software, silicon and board design to dramatically accelerate embedded system design, optimization, debug and deployment compared to typical development life cycles. Product is designed to accelerate the complete embedded development flow – from architecting the design to optimization, debugging, pcb design, schematic review, software, AI and deployment of the actual system.
Aratas America LLC launches officially
Aratas America LLC, the trusted innovative technology solutions provider, officially launches as an independent company following the transfer of shares held by OMRON Corporation to The Carlyle Group. Established in July 2026, Aratas America LLC builds on OMRON’s more than 90 years of engineering expertise and its legacy of innovation, quality and customer collaboration.
Open harmonized FPGA module interconnects boost performance
SAMTEC oHFM, or Open Harmonized FPGA Module Connector portfolio is designed for the SGeT oHFM.c standard, and is based on firm’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families. The open modular FPGA standard addresses the common challenges of unique pinouts, custom form factors, and proprietary thermal concepts of FPGA and SOM development by providing a unified, scalable architecture.
Privacy concerns put smart glasses under scrutiny
A trip to the park. A day at the beach. A workout session at the gym. All in public spaces where smart glasses can snap photos, record conversations or stream video online — without people in the line of their lenses and microphones knowing about it. Norway’s government wants to get a handle on both the promise and peril of AI glasses, and is proposing that parliament enact a temporary ban on them in some places.
Cooling is becoming a first-order design constraint for AI hardware
For decades, engineers settled on a design architecture for semiconductors that prioritized performance and cost, leaving thermal management as an afterthought. Heatsinks, fans and airflow paths were treated as a downstream problem, but now that compute density and power consumption to feed AI systems is rising, the original order of operations is being challenged.
DigiKey releases ‘Factory Tomorrow’ video series
DigiKey has launched Season 6 of Factory Tomorrow, a video series highlighting how manufacturers and technology suppliers are building the foundation for the next generation of industrial production. From AI-enabled data centres powering Industry 4.0 to the networks that move power and data across the factory floor, this three-episode season of Factory Tomorrow explores how industry leaders like Phoenix Contact and Belden are helping manufacturers build more connected, intelligent factories.
Acid Resistant, Non-drip epoxy system withstands elevated temperatures
MASTER BOND EP62-1HTND two component epoxy system is formulated for bonding and sealing applications requiring high temperature capability and chemical resistance, particularly to acids. System exhibits a non-drip paste consistency with no flow upon mixing, making it suitable for application on vertical or non-horizontal surfaces. It resists a variety of aggressive chemicals, including sulfuric acid, nitric acid, hydrochloric acid, bases, and solvents.
element14 Community launches smart sustainability design challenge
Global engineering community invited to develop innovative recycling, waste management and sustainability solutions element14, an Avnet community, has launched a smart sustainability design challenge inviting engineers, makers and technology enthusiasts to design and build innovative projects focused on recycling, waste reduction and environmental sustainability.