International Microelectronics and Packaging Society
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"IMAPS leads the microelectronics packaging, interconnect and assembly community, providing means of communicating, educating and interacting at all levels."
WHAT IS IMAPS?
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
WHO ARE IMAPS MEMBERS?
IMAPS is the leading international microelectronics and electronic packaging society representing more than 3,000 members around the world in US, European, and Asian chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS hosts a variety of technical workshops, conferences, and professional development courses that enable these professionals to enhance their careers. In addition, the Microelectronics Foundation provides annual grants to students involved in electronic packaging disciplines.IMAPS members enjoy the Society's unending commitment to be the premier entity dedicated to the dissemination of technical and commercial information about electronic packaging. Source
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| Scope | International |
|---|---|
| Language | English |
| Country | United States of America |
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Recent Articles
Search ArticlesUpcoming IMAPS Silicon Valley Event
Upcoming IMAPS Silicon Valley Event 5 hours ago Some of the semiconductor industry's leading experts will be in one room on August 11.
CHIPcon and ThermCon Events Score in Santa Clara!
Edit This Favorite Name: Category: Share: Yes No, Keep Private CHIPcon and ThermCon Events Score in Santa Clara! 5 hours ago The co-located IMAPS CHIPcon and ThermCon events were held June 6-8, in Santa Clara, California, demonstrating that the core value of in-person conferences — organic networking and accessible experts — is alive and well.
New Advanced Packaging Magazine Issue on Advanced Semiconductor Packaging & Thermal Management
New Advanced Packaging Magazine Issue on Advanced Semiconductor Packaging & Thermal Management 3 hours ago (0 Comments) The latest issue of IMAPS' Advancing Microelectronics magazine focused on Advanced Semiconductor Packaging and Thermal Management is now available. This issue features: Messages from the General Chairs of CHIPcon (Ou Li) and ThermCon (Dongkai Shangguan), which will be held July 6–8 in Santa Clara, California. Event programs for both conferences are also included.
IDSPS Event in India: IMAPS partnering for Exhibit Zone
IDSPS Event in India: IMAPS partnering for Exhibit Zone 1 hour ago IMAPS is proud to be an organizing partner for the IDSPS exhibition and technical program scheduled for December 6-9, 2026 in Visakhapatnam, India. The Indian Global Semiconductors to Systems, Research & Technology Conference will bring global industry and academic leaders together with 600–700 expected participants.
Join the Florida Chapter Lunch & Learn on June 9
Join the Florida Chapter Lunch & Learn on June 9 Wednesday, May 20, 2026 Lunch and Learn with the IMAPS Florida Chapter on June 9 in Palm Bay, Florida Speakers: 🎤 Dr. David Ekhaguer, CSE at L3 Harris Technologies: UAS Long Endurance Battery Architecture Harvesting Approaches 🎤 Stephanie Moore, University Florida: Laser-Machined Interposer with Diamond-Coated Capillary Surfaces for Hotspot Mitigation in 3D Heterogeneous Integration (3DHI) Packaging 🎤 C.
New Student Scholarship Now Accepting Applications
New Student Scholarship Now Accepting Applications Friday, May 1, 2026 New IMAPS Scholarship Announced A new IMAPS 3D InCites Student Scholarship was recently announced that will support workforce development in the advanced packaging industry. Funds were donated last year by 3DI and the first scholarship will be awarded this year.
Podcast Conversations: 3D InCites Now Powered by IMAPS
Podcast Conversations: 3D InCites Now Powered by IMAPS 1 hour ago In this two-part podcast series, listen to conversations about the transition of the 3D InCites (3DI) media platform to the IMAPS portfolio. This move ensures the continuation of the 3DI website, content library, and podcast series under the IMAPS umbrella. 3DI delivers a technology and innovation spotlight for engineers, researchers, manufacturers, and students across the microelectronics and advanced packaging sectors.
Florida Chapter Event April 9: Speakers Announced
Florida Chapter Event April 9: Speakers Announced 8 hours ago The IMAPS Florida Chapter Workshop on Smart Sensors, µActuators & Small Autonomous Systems ~ last chance for abstract submission. Don't miss out on a opportunity to speak at this full day event on April 9 ~ it will cover the latest microelectronic based design, process and materials for integration of smart sensors and photonic technologies and platforms. Who should attend?
IMAPS Announces Purchase of the 3D InCites Platform
IMAPS Announces Purchase of the 3D InCites Platform 12 hours ago The International Microelectronics Assembly and Packaging Society (IMAPS) is pleased to announce a major milestone for the Society, with IMAPS taking over the "stewardship" of the trusted 3D InCites platform which was owned by Françoise von Trapp and her partner Martijn Pierik. Following Françoise’s retirement, IMAPS purchased the 3D InCites platform, including its website, content library, and podcasts.
IMAPS announces supporting sponsorship of the Components for Military & Space Electronics Conference
Edit This Favorite Name: Category: Share: Yes No, Keep Private IMAPS announces supporting sponsorship of the Components for Military & Space Electronics Conference 8 hours ago IMAPS announces its supporting sponsorship of the 29th Annual Components for Military & Space Electronics Conference & Exhibition (CMSE 2026), taking place April 28–30, 2026 at the Marriott Renaissance Los Angeles Airport Hotel.