Packaging Tech Today
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Magazine
Packaging Technology Today was first introduced in 1996 and is the most comprehensive packaging publication produced. It was designed primarily for the entrepreneur whose primary objective is to buy or sell equipment, materials, and services. Packaging Technology Today is published monthly and circulated to qualified packaging companies, dealers and brokers. Advertisers benefit from our exclusive circulation targeted to qualified buyers. Source
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| Scope | Trade/B2B |
|---|---|
| Language | English |
| Country | United States of America |
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Recent Articles
Search ArticlesNORD Announces NXD tupH for Reliable Surface Protection in Extreme Conditions
The system offers PFAS-free surface protection in wash-down applications. NXD tupH® Sealed Surface Conversion System from NORD DRIVESYSTEMS is a state-of-the-art surface protection solution that is made to withstand harsh environmental conditions such as hygiene-sensitive applications in Food and Beverage, Pharmaceuticals, Packaging, and other demanding environments.
Texwrap Serves as Strategic Packaging Consultant to Eliminate Material Waste and Cut Rising Film Costs
Free diagnostic “tune-up” service helps distributors and end-users optimize machinery settings. As fluctuating oil prices drive up the cost of plastic shrink film across global supply chains, Texwrap is stepping in to help food, CPG, and industrial manufacturers find critical operational efficiencies right on their plant floor.
TMP 1801: Early Automated Label Print & Apply System
|Coding/Marking/Labeling, Machinery, New Products, Upcoming Conference News FOX IV is bringing something OLD to PACK EXPO — very old. About 40 years old! In celebration of FOX IV’s 30th Anniversary and 30 years of labeling innovation, they are bringing one of the first label print-and-apply systems ever manufactured, the TMP 1801, to PACK EXPO 2026.
PACK EXPO International 2026 Brings the Future of Packaging and Processing to Chicago
North America’s most comprehensive packaging and processing event features 2,700+ exhibitors, 150+ educational sessions, and more. The countdown is on. In just a few days, the packaging and processing industry will come together for PACK EXPO International 2026, October 18–21 at McCormick Place in Chicago. With more than 2,700 exhibitors, solutions for 40+ vertical markets will fill over 1.3 million net square feet of exhibit space.
Yangi® Showcases New Foodservice Range at PACK EXPO, Putting Cellera® Dry-Forming Capabilities on Display
Yangi’s quick-serve and takeaway application range showcases the breadth, speed, and flexibility. Yangi is bringing a new foodservice application range to PACK EXPO International in Chicago, giving converters and brands a tangible view of what can be achieved with Cellera® — Yangi’s industrial dry-forming technology for producing dry-molded fiber packaging.
Metal Detectors for Hidden HACCP Risks
Strategic metal detection helps food processors strengthen Hazard Analysis Critical Control Points (HACCPs) and prevent contamination. By Eric Garr, Food Safety Specialist, Fortress Technology When consumers pull a product from a retail shelf, their focus is often on branding, nutrition, and ingredients. Few shoppers contemplate the complexity involved in establishing and safeguarding Critical Control Points (CCPs) on food production lines, but manufacturers do.
IPCO Unveils High-Performance Chocolate Forming Solutions at PACK EXPO 2026
IPCO will showcase its innovations at PACK EXPO booth S-2287. IPCO, a leading supplier of chocolate forming and molding equipment, will showcase its latest innovations at PACK EXPO 2026 booth S-2287, emphasizing advancements in chocolate chip production and cooling systems. The company introduced the Rotoform HP (High Performance) rotary drop depositor, designed to enhance productivity in chocolate chip forming.
BOBST Connect: Progress, Performance, and Potential
Exploring the BOBST Connect journey so far and its current and future impact on the packaging industry. Several years on from its launch in 2022, BOBST Connect has evolved into a central pillar of BOBST’s vision for a connected, data-driven packaging industry. What began as a digital platform providing remote access to machine and performance data has become a comprehensive digitalization ecosystem – integrating machines, workflows, quality systems and factory software across entire plants.
Navigating the 2D Transition
The GS1 Sunrise 2027 initiative aims to transition from 1D barcodes to 2D barcodes by 2027. By Rémy Fontanet, Solutions Business Development Manager at Markem-Imaje Today’s packaging operations and brand owners must navigate a complex operational landscape shaped by rising raw material costs, labor shortages, and expanding expectations around sustainability and supply chain transparency.
Shurtape Technologies, LLC, to Highlight Packaging Performance and Sustainability Solutions at PACK EXPO International 2026
See end-of-line packaging performance and sustainability innovations at Booth N-6030, Oct. 18-21 Shurtape Technologies, LLC, an industry-leading manufacturer and marketer of adhesive tape and consumer home and office products, will bring its latest packaging end-of-line performance and sustainability solutions to PACK EXPO International 2026, Oct. 18-21, in Chicago.