Printed Circuit Design & Fab

The Charge of the Bucket Brigade An exploration of the PDN bucket brigade concept. READ MORE... UHDI Capability Charts The difference between process capability and design intent. READ MORE... Flex DfM Guidelines, Part 1 Understanding key flex DfM guidelines. READ MORE... RF PCB Layout Analog PCB design demands careful attention. READ MORE... Flexpert Bending with Attached Structure Dynamic flex applications require careful consideration. READ MORE...

NEW DELHI – Lam Research plans to invest approximately $1.2 billion in India over the coming years to establish its first silicon component manufacturing facility in the country and expand its research and development operations. Entrepreneur India The proposed facility will support a vertically integrated manufacturing process spanning silicon ingot production and processing for advanced semiconductor technologies and leading-edge nodes.

ADELAIDE, AUSTRALIA – NCAB Group has agreed to acquire the operations of IMP Electronics Solutions, expanding the PCB supplier’s presence into Australia and New Zealand. The transaction includes IMP’s 12 employees in Australia and China and is expected to close in the fourth quarter of 2026. Founded in 1964, IMP is a printed circuit board trading company serving industrial and defense customers.

The Charge of the Bucket Brigade An exploration of the PDN bucket brigade concept. READ MORE... UHDI Capability Charts The difference between process capability and design intent. READ MORE... Flex DfM Guidelines, Part 1 Understanding key flex DfM guidelines. READ MORE... RF PCB Layout Analog PCB design demands careful attention. READ MORE... Flexpert Bending with Attached Structure Dynamic flex applications require careful consideration. READ MORE...

The Charge of the Bucket Brigade An exploration of the PDN bucket brigade concept. READ MORE... UHDI Capability Charts The difference between process capability and design intent. READ MORE... Flex DfM Guidelines, Part 1 Understanding key flex DfM guidelines. READ MORE... RF PCB Layout Analog PCB design demands careful attention. READ MORE... Flexpert Bending with Attached Structure Dynamic flex applications require careful consideration. READ MORE...

The Charge of the Bucket Brigade An exploration of the PDN bucket brigade concept. READ MORE... UHDI Capability Charts The difference between process capability and design intent. READ MORE... Flex DfM Guidelines, Part 1 Understanding key flex DfM guidelines. READ MORE... RF PCB Layout Analog PCB design demands careful attention. READ MORE... Flexpert Bending with Attached Structure Dynamic flex applications require careful consideration. READ MORE...

SCHAUMBURG, IL -- TFE has acquired TEKENA USA LLC, expanding its portfolio of particle removal and surface cleaning technologies for precision manufacturing. The acquisition adds sheet and web cleaning systems, contact cleaning equipment, adhesive rolls, manual cleaning products, consumables and related services to TFE’s North American offerings. TEKENA’s products remove dust, fibers and other contaminants that can affect product quality, process consistency and manufacturing yield.

The Charge of the Bucket Brigade An exploration of the PDN bucket brigade concept. READ MORE... UHDI Capability Charts The difference between process capability and design intent. READ MORE... Flex DfM Guidelines, Part 1 Understanding key flex DfM guidelines. READ MORE... RF PCB Layout Analog PCB design demands careful attention. READ MORE... Flexpert Bending with Attached Structure Dynamic flex applications require careful consideration. READ MORE...

TORRANCE, CA -- Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will host a free technical webinar, “Current Status and Challenges of Millimeter-Wave Measurement,” on September 23, 2026, at 4 p.m. PST. The presentation will examine the growing role of millimeter-wave technologies and the measurement challenges that accompany their continued development across communications, radar, medical, security and automotive applications.

The electronics industry is moving toward chiplet architectures, advanced packaging, and substrate-like printed circuit boards that demand sub-25-micron circuitry and sub-0.3 mm pitch placement. Yet no peer-reviewed solder print study has systematically evaluated stencil performance, paste deposition, and inspection metrology at the aperture dimensions these geometries require. The UHDI Consortium was formed to close that gap.