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| Country | United Kingdom |
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Recent Articles
Search Articlesbinder expands the M12 portfolio with angled PCB connectors
binder is expanding its M12 program with angled panel-mount connectors for centric PCB mounting. The connectors receive the circuit board at its edge and sit flush with it, rather than on top of it. As a result, the connector and the board no longer add up in height – an advantage wherever the electronics need to fit into a slim, cylindrical housing. The THR version is reflow-solderable and can be processed on the existing SMT line without any special steps.
Avnet Silica strengthens sensing portfolio through new distribution agreement with LEM
Avnet Silica has announced a new distribution agreement with LEM, a global provider of current and voltage measurement solutions. Under the agreement, Avnet Silica will offer LEM’s portfolio of PCB-mounted and module-mounted current sensors, covering currents from below 1 A up to 42 kA, voltage sensors for applications up to 6.4 kV, and Rogowski coil solutions for grid monitoring and instrumentation.
Melexis unveils versatile integrated current sensor platform
Melexis has introduced the MLX91224 and MLX91225, expanding its isolated current sensor portfolio for high-voltage automotive and industrial applications. Delivering plug-and-play measurement up to 100 ARMS, ASIL B readiness, and a fast analog response across three package options, these new devices simplify design for EV powertrains, DC-DC converters, chargers, and solar systems.
Mouser’s Alternative Energy Resource Centre Provides Engineering Insights into New Decentralised Systems
Mouser supports design engineers with its online alternative energy resource centre by providing technical content and practical insights for developing cleaner, more efficient, sustainable and decentralised energy systems. This resource centre supports advances in renewable generation, energy harvesting, and smart grids, connecting emerging energy concepts with the components and design approaches needed to implement them.
Rohm’s silicon carbide contributes to the “Neue Klasse” electric powertrain architecture of BMW
Rohm Semiconductor announces that its innovative power semiconductor solutions are being utilised in electric vehicle platforms from a leading global premium automotive manufacturer. In BMW’s “Neue Klasse”, Rohm’s SiC (Silicon Carbide) chips support the efficiency, performance, and reliability of the vehicle’s electric powertrain systems.
Harwin launches online connector selection platform to reduce complexity in design and prototyping phase
Harwin has announced a new online interactive Connector Selector tool that has been developed to simplify interconnect specification. The connector selector tool will be available via Harwin’s website complementing the company’s existing technical support and digital resources. These include a virtual showroom, cable configurator, availability checker, and downloadable CAD models from Supplyframe and TraceParts.
CELUS Design Platform now available on NXP.com to accelerate system solution discovery and design-In
CELUS has announced that the CELUS Design Platform is now live on NXP.com in a co-branded experience featuring NXP Semiconductors’ components and system solutions. Debuting around Embedded World North America 2026, the launch introduces a new digital path for engineers to move from high-level application intent to electrically correct schematics that embed NXP technologies in real system context. For component manufacturers and distributors, the announcement signals a clear shift in go-to-market.
Infineon announces new dual channel gate driver for AI datacenter power designs
Infineon has introduced the EiceDRIVER 2EDL6014AC-G2D, a 120 V junction-isolated dual channel floating output gate driver engineered for high-density silicon power designs in AI datacenter applications. Housed in a compact WQFN-12 2.2 mm x 2.2 mm package, the device addresses the growing demand for power conversion solutions that deliver higher server rack density without sacrificing reliability or thermal performance.
ST reveals sizeably smaller intelligent power modules
STMicroelectronics has announced small low-loss intelligent moulded modules (SLLIMM) with direct-bonded copper (DBC) in a new compact outline for industrial drives, air conditioners, heat pumps and home appliances. The space-saving modules deliver a complete 600V, 3-phase IGBT inverter bridge with an 18.8mm x 32.8mm footprint, which is more than 30% smaller than existing IGBT IPM in DBC packages.
Anglia Components is now stocking Adam Tech components
Anglia Components is now stocking a wide range of products from Adam Tech, following the signing of a pan-European franchise agreement with the US manufacturer of connectivity components and cables, electromechanical products, and power and protection solutions. Explains David Pearson, Technical Director at Anglia: “Adam Tech’s commitment to delivering high-quality products, exceptional service and competitive pricing aligns perfectly with Anglia’s own values and customer-first philosophy.