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Mikroe brings the Skylark Precise Positioning Service to its GNSS 19 Click (SE868K5-D variant) Click board. GNSS 19 Click is a compact add-on board designed for multi-constellation GNSS positioning, navigation, and tracking in demanding outdoor environments. This board is based on the SE868K5-D, a standard dual-frequency multi-constellation GNSS module from Telit Cinterion, which provides accuracy by using multiple frequency bands and constellations simultaneously.

dSPACE is introducing MCP-enabled AI workflows that connect AI Agents directly with dSPACE tools. Based on the open Model Context Protocol (MCP), this approach helps engineers transition from isolated prompt-based tasks toward connected, specification-driven validation workflows. In modern automotive development, requirements, specifications, simulations, implementations, and tests are often managed in different tools and environments.

Toshiba Electronics introduces two photorelays, the TLP3487 and TLP3491, designed for semiconductor test equipment. Housed in a compact P-SON4 package, the devices support a high ON-state current with low OFF-state leakage current to help maintain measurement accuracy. Typical applications include automated test equipment (ATE), measuring instruments, and high-speed logic IC, memory and SoC testers, as well as peripheral equipment used in semiconductor test environments.

ROHM has announced the launch of the English-language version of Engineer Social Hub, an online platform designed to make ROHM’s technical information, know-how, and support more accessible to engineers. Engineer Social Hub brings together ROHM’s technical content related to semiconductor products and solutions in one place. Through product-specific FAQs and discussions, as well as a chatbot, users can search for solutions to technical questions and obtain direct support from ROHM engineers.

Kioxa Europe have announced its UFS(1) 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.

element14, an Avnet community, has launched a new smart home and healthcare design challenge inviting engineers, makers and technology enthusiasts to design and build innovative prototypes focused on improving everyday living environments and personal wellbeing. The challenge encourages participants to create a prototype smart home or healthcare system designed to support a happier, healthier person or household.

Iridium has announced a strategic partnership with Skywave to help heavy equipment manufacturers build and scale more resilient connected equipment services across global operating environments. As heavy equipment manufacturers expand connected services, they face growing pressure to improve equipment uptime, modernise legacy deployments, and deliver a consistent customer experience across fleets operating in remote and often disconnected locations.

Danisense has announced their new high-precision DP12IP current transducer designed for isolated DC and AC current measurement in demanding PCB-mounted power electronics applications. Based on Danisense’s closed-loop compensated fluxgate technology, the DP12IP series combines ppm-class accuracy with a maximum linearity error of just 10 ppm and long-term stability in a compact PCB-mount package featuring a form factor of only 32mm and weighing only 250g.

Renesas has announced its third‑generation (Gen 3) DDR5 Multiplexed Rank Dual In‑Line Memory Module (MRDIMM) chipset solutions, delivering DDR5 server-class MRDIMM speeds up to 16,000 mega transfers per second (MT/s). The new solutions are designed to address the growing demand for higher memory bandwidth driven by artificial intelligence (AI) data centres, cloud infrastructure and accelerated compute workloads.

STMicroelectronics has extended the STGAP3S family of gate drivers that feature enhanced galvanic isolation for greater reliability, introducing an efficient and economical 3A series for circuits that need lower drive current. The new STGAP3S3S is optimised for silicon carbide (SiC) MOSFETs, while the STGAP3S3IF is suited to IGBTs. All STGAP3S drivers work with high-voltage rails up to 1200V in circuits such as power-factor correction (PFC), power supply units, DC/DC converters, and inverters.