Market Leaders Including Cisco, MediaTek, NVIDIA, and Samsung Foundry Demonstrate Measurable Impact, Advancing the Shift from Overdesign to Co-design Key Highlights Integrates golden signoff multiphysics analysis directly into timing signoff, design closure, multi-die, and analog workflows, enabling earlier, more accurate design decisions Enables SPICE-accurate multiphysics timing analysis with up to 3x faster runtimes Delivers up to 10x faster design closure with higher ECO success rates and...