TechInsights

2027 CMC Conference • Semiconductor Materials Conference The 2027 Critical Materials Council (CMC) Conference brings together semiconductor fabs, materials suppliers, equipment companies, and industry leaders in Chandler, Arizona, to address the materials, manufacturing, and supply chain challenges shaping the semiconductor industry. *Private meetings and the CMC Joint Session will take place during the same week as the CMC Conference.

August 31, 2026 Imagine receiving an ultimatum from your largest customer, perhaps a global hyperscaler or a leading automotive manufacturer. The message is clear: Provide verifiable, audit-grade greenhouse gas emission data for the components you supply, or risk losing your contract entirely. This scenario isn't a distant, hypothetical future. It is the immediate reality facing the entire semiconductor ecosystem.

August 27, 2026 TechInsights has reverse-engineered the process flow of the HiSilicon Kirin 9030 Pro, fabricated by SMIC using its N+3 process technology. The analysis examines front-end-of-line (FEOL) and back-end-of-line (BEOL) critical dimensions, patterning strategies, and the complete lithography mask set.

August 25, 2026 The Intel Core Ultra X7 358H brings together three separately manufactured tiles within a single Foveros-S 2.5D package. The processor combines an Intel 18A compute tile with graphics (GPU) and platform controller tiles (PCT) fabricated by TSMC, representing Intel's latest implementation of a disaggregated client microprocessor architecture.

Sort blogs Try another search term or clear your filters. Where are hyperscalers concentrating datacenter capacity? Q1 2026 data shows why 15 of the top 20 markets are in the US and which cloud providers lead. Memory packaging has become a primary differentiator in AI accelerator performance. We take a look at Micron's HBM3E packaging architecture for the NVIDIA HGX B300. Advanced packaging does not move as a single market.

August 21, 2026 Optical transceiver power consumption in AI datacenters will surpass 2.5 GW by 2030 under legacy pluggable architectures. As a result, the total transceiver market revenue is projected to grow from $9.7 billion in 2025 to over $84.3 billion by 2030, with co-packaged optics (CPO) emerging as a major source of market growth. Understanding the growing CPO opportunity requires more than a market forecast.

August 20, 2026 KEY FINDINGS The US dominates hyperscale datacenter capacity: 15 of the world’s top 20 hyperscale datacenter markets were in the US, while the top 20 collectively accounted for 60% of global capacity. The geographic rankings are shifting: Texas hyperscale capacity grew 71% over the past year, compared with 36% worldwide, while markets including Indiana, Tennessee, Guangdong, Johor, and Jakarta are gaining ground.

An Analysis of the Interconnect and Packaging Architecture August 19, 2026 TechInsights completed an interconnect and packaging analysis of the Micron 12Hi HBM3E memory package extracted from an NVIDIA HGX B300 Blackwell Ultra accelerator. This is the first Micron high-bandwidth memory (HBM) device analyzed by TechInsights. Using cross-section imaging, X-ray inspection, scanning electron microscopy (SEM), and delayering, the analysis characterizes the full 3D die stack.

TechInsights · Behind the Headlines Every semiconductor announcement has two stories—the one on the surface, and the real story grounded in physical evidence, market data, and 35 years of reverse engineering. This is where you find the second one. Engineering AMD Bets on Open Interconnects to Challenge NVIDIA's Rack-Scale Lead AMD’s MI400 and Helios platform look like another challenge to NVIDIA’s AI infrastructure dominance.

August 17, 2026 Advanced packaging does not move as a single market. The broader logic packaging market still ships primarily in conventional leadframe, substrate-based, and wafer-level or fan-out packages. At a smaller scale yet with the highest valuation, processors are driving rapid adoption of technologies such as 2.5D, 3D, and fan-out packaging.