Open AccessArticle by Siliang He 1,2, Bifu Xiong 1, Fangyi Xu 1, Biyang Chen 1, Yinhua Cui 2, Chuan Hu 2, Gao Yue 1,3,* and Yu-An Shen 4,* 1 Guangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China 2 Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China 3 Guilin Fuda Co., Ltd., Guilin 541199, China 4 Department of...