Abstract Femtosecond laser direct writing (LDW), which uses ultraviolet, visible or infrared lasers, is a maskless subtractive manufacturing approach that is widely used for precision surface processing. This is because of the strong spatial confinement of laser energy and minimal collateral damage. Here, we present a conceptual scheme for the high-precision machining of semiconductor materials using LDW with sub-micron-focused extreme ultraviolet (EUV) laser pulses.
