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ABSTRACT Direct metallisation of epoxy moulding compound (EMC) requires conductive seed coatings that resist detachment. Cu and Ni were deposited on cured HS711 EMC by direct-current magnetron sputtering at programmed quartz-monitor endpoints of 50 and 100 nm; a rate-endpoint audit distinguished these specimens from 60 s screening runs. X-ray diffraction supported face-centred-cubic phase assignments.
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