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Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip
BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of chip by using wire-bonding through the central slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which enables I/O pins to diversify and chip to stack vertically, thus it is widely used in memory chip as it is easy to achieve high speed & high density.
Fingerprint Identification pcb ultrathin pcb manufacture
Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the memory IC packaging, and the share of IC substrate.
FCBGA/BGA package substrate manufacture
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless RF-Memory (DDR SDRAM)-Cell phone-Workstation, Server, Video Camera -Desktop PC, Note book PC,Wearable electronics,Car/automotive...
3d nand flash memory
Home Products Suppliers Selling leads English Français Русский язык Español 日本語 Português 1 - 20 Results for 3d nand flash memory from 28806 Products Inquiry Cart 0
wire bonding memory substrate with gold plating manufacture
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or Customize; Layer:1-6 layer (Customize); Soldermask:Green or Customize...
sandisk pro duo memory card
登录 免费注册 [退出] “贸易通"多语言推广 外贸旺站免费建站 外贸论坛 Home Products Suppliers Selling leads English Français Русский язык Español 日本語 Português 1 - 20 Results for sandisk pro duo memory card from 17098 Products Inquiry Cart 0
fifo memory chip
登录 免费注册 [退出] “贸易通"多语言推广 外贸旺站免费建站 外贸论坛 Home Products Suppliers Selling leads English Français Русский язык Español 日本語 Português 1 - 20 Results for fifo memory chip from 24198 Products Inquiry Cart 0
sony ps2 memory card
登录 免费注册 [退出] “贸易通"多语言推广 外贸旺站免费建站 外贸论坛 Home Products Suppliers Selling leads English Français Русский язык Español 日本語 Português 1 - 20 Results for sony ps2 memory card from 14207 Products Inquiry Cart 0
RF/Wireless/5G IC module substrate manufacture
Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or...
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