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Articles by Irving Wang..
IMAPS 3D InCites Content Platform
Die bonding is a manufacturing process used in the packaging of semiconductors. It is the act of attaching a die (or chip) to a substrate or package by epoxy or solder, also known as die placement or die attach. The process starts with picking a die from a wafer or waffle pack and then placing it at a specific location on the substrate. The die is placed into a previously dispensed epoxy or placed into solder (eutectic).
Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?
By Tobias Gleichmann In advanced packaging, the real challenge usually doesn’t show up during development. It shows up when processes need to run reliably in production. Everything works in the lab. Then production begins. And suddenly, nothing behaves the same. But in many cases, the issue was already built in. If the bonding strategy is not validated with production in mind, cost and risk are carried forward from the very beginning. That is why problems appear later.
MRSI Launches New Die Bonders with Improved Accuracy
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems is proud to announce the introduction of the MRSI-HVM1 and MRSI-H1 die bonders with 1µm machine accuracy.
MRSI Receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for Photonic Components category. The MRSI-H-HPLD die bonder was recognized as among the best by the 2022 Laser Focus World Innovators Award.
MRSI to Exhibit with Live Demonstrations and Present at the China International Optoelectronic Expo
We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th China International Optoelectronic Exposition (CIOE) and will present at the CIOE Conference. This event will be held from September 7-9th at the Shenzhen World Exhibition and Convention center.
MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry
MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC (“Lumentum“, NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR industry. This collaboration promises to generate innovative LiDAR solutions for the industry. LiDAR (light detection and ranging) technology is becoming the standard equipment in medium-end and high-end vehicles.
MRSI Launches New Die Bonder with Improved Throughput for High Power Laser Manufacturers
MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. MRSI-H-HPLD+ will be available in the 3rd quarter of 2022.
China's Semiconductor Industry Experiences Continued Growth
China’s semiconductor industry shows no signs of slowing down. China has a steady stream of projects signed and initiated in June alone. The few deals we’ve discussed show over 81 billion yuan (the equivalent of $12.1 billion) invested in just three weeks. Most of the projects launched include new manufacturing headquarters, which explains China’s orders of chip-manufacturing equipment from overseas suppliers.
Sustainability 101: The Struggle to Remove Lead from Solders
My last post here asked the question, are your products toxic? Perhaps I should have said your products are toxic. What do you plan to do about that? Removing even one toxic compound from semiconductor manufacturing takes much longer than expected. Leaded or Unleaded? Lead in solder is an excellent example. Twenty years after the industry started weaning itself off of Pb-based solders in anticipation of the Restrictions on Hazardous Substances (RoHS) directive, we are still not done.
The Supply Chain Changes History
President Biden’s recent visit to South Korea, meeting the heads of South Korean conglomerates, and a plan to visit Samsung’s semiconductor fab are closely related to a restructuring of the US-centric supply chain.
Catching up with Steve Breit at the TSensors Summit
A journey of a trillion sensors begins with a single step. The TSensors Summit, held at Stanford University on 23 – 25 October 2013, was a showcase for the ideas and strategies that will lead the electronics industry to produce very high volumes of Microelectromechanical Systems (MEMS)-based sensors for use in new applications likely to enter the market in the coming decade.
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