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Conflicts of Interest The authors declare no conflicts of interest. Data Availability Statement The data that support the findings of this study are available from the corresponding author upon reasonable request. References 1, , and , “Boron Nitride Filled Epoxy With Improved Thermal Conductivity and Dielectric Breakdown Strength,” Composites Science and Technology 110 (2015): 152–158, https://doi.org/10.1016/j.compscitech.2015.02.006.
ABSTRACT A coupled cellular automaton-finite element model was created to simulate solidification structure growth, which was validated experimentally. Simulations were conducted to examine the temperature distribution and growth of the solidification structure during the initial phase within the mold. Temperatures were measured in four key regions: the wide face center, narrow face center, corner, and hot spot. The growth of the solidification structure in these regions was also simulated.
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