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Increasing miniaturization, power densities and internal heat dissipation of novel electronic packages have made their solder interconnections more vulnerable to failures. To improve the reliability of electronic devices the underlying physical failure mechanisms of solder interconnections must be clarified in detail in order to find means to control, or even prevent, the development of failures.
The creep behaviour of solders is an important input for accurate material models for FE-analysis of electronic assemblies. Usually the mechanical behaviour of solders has been determined by tensile tests on bulk solder specimens. Although performing these tests is not complicated and the results are easy to interpret, one of the key problems lies in the fact that solder joints are very small and, therefore, cannot be represented by large tensile specimens.
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