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The creep behaviour of solders is an important input for accurate material models for FE-analysis of electronic assemblies. Usually the mechanical behaviour of solders has been determined by tensile tests on bulk solder specimens. Although performing these tests is not complicated and the results are easy to interpret, one of the key problems lies in the fact that solder joints are very small and, therefore, cannot be represented by large tensile specimens.
In this study the solder alloys SnAg3.5, SnAg3.0Cu0.5, SnAg3.8Cu0.7 and SnAg2.7Cu0.4Ni0.05 have been analysed in order to determine variations in microstructure caused by cooling rate, solder composition and ball diameter. Solder spheres with a diameter of approx. Ø 1100 μm, Ø 590 μm, Ø 270 μm and Ø 130 μm were solidified with cooling rates of 0.14K/s, 1.1K/s and 10.9K/s. Cross sections of these specimens were analysed by optical light microscopy.
The creep behaviour of solders is an important input for accurate material models for FE-analysis of electronic assemblies. Usually the mechanical behaviour of solders, is been determined by tensile tests on bulk solder specimens. Although performing these tests is not complicated and the results are easy to interpret, one of the key problems lies in the fact that solder joints are very small and therefore cannot be represented by large tensile specimens.
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