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| Scope | National, Trade/B2B |
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| Language | English |
| Country | United States of America |
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Recent Articles
Search ArticlesAI agents speed silicon-to-system engineering
AgentEngineer domain-specific, long-horizon agents from Synopsys accelerate engineering across silicon-to-system design. Built on the Autopilot open platform for autonomous engineering, the agents apply AI to workflows spanning verification, implementation, analog, manufacturing, simulation, and analysis in a single unified environment.
SBRFP rectifiers cut losses in automotive systems
Diodes’ automotive Field-Plated Super Barrier Rectifiers (SBRFP) provide low forward voltage and low reverse leakage current. The 2-A SBRFP2M60P1Q and SBRFP2M60SAFQ, 3-A SBRFP3M60SAFQ, and 8-A SBRFP8A60P5Q are drop-in replacements for comparable Schottky and PN junction diodes. Based on a MOS manufacturing process, Diodes’ SBRFP technology overcomes the limitations of conventional Schottky and PN junction technologies.
64-bit soft SoC expands FPGA processing
Efinix offers the Sapphire RV64, a configurable 64-bit RISC-V soft SoC optimized for the company’s Trion and Titanium FPGAs. The SoC incorporates a cached RISC-V processor core and optionally includes a DDR DRAM controller interface. It also supports a range of peripherals.
160-W power supply withstands harsh conditions
Advanced Energy’s DF150 160-W AC/DC power supply is built for extreme environments in defense and industrial applications. The first entry in the Defiant Future (DF) series of ruggedized, high-reliability power supplies, the DF150 is certified to MIL-STD-810H, withstanding shock, vibration, altitude variations, and temperature extremes. It also provides enhanced EMC performance and complies with MIL-STD-461G requirements.
Tiny IC packs analog and logic functions
At just 1.155×1.155 mm, the Renesas GreenPAK SLG46801 configurable mixed-signal IC is small enough for use in smart rings and watches. Its 9-ball WLCSP makes it the smallest device in the GreenPAK family, combining an ultra-compact footprint with multi-time programmability (MTP). The SLG46801 integrates commonly used functions that complement an MCU or replace multiple discrete components in analog signal-processing applications.
Cesium atomic clocks: The backbone of precise 5G timing
As 5G networks expand in scale, complexity, and societal importance, the underlying timing infrastructure that keeps them synchronized has become a strategic technology domain. While radio access innovations—massive multiple‑input multiple‑output (MIMO), beamforming, millimeter‑wave deployments—often dominate public discussion, the stability and accuracy of network timing are just as critical. Without precise timing, 5G’s most advanced features simply cannot function.
Wire pushbuttons in series to simplify DPOT up/down circuit
A curious connection of control buttons makes a simpler-is-better digital potentiometer interface possible. Two recent submissions to the Design Ideas kitchen (see Related Content) have shown different basic step-per-push pushbutton interfaces for up/down digital potentiometers. Since they have the same purpose and perform the same function, they mostly can only meaningfully differ in their respective part counts. Which they did.
When AI agents make decisions, trust becomes infrastructure
AI agents are beginning to change something more fundamental than how organizations use software. They are beginning to receive authority. A conventional AI system can provide information, summarize data, identify alternatives, or recommend an action. An agent can increasingly go further. It can select an action, execute it, commit resources, change a system, initiate a transaction, and modify an engineering workflow. And potentially make decisions without waiting for a human at every step.
Getting ready for 6G networks
As 5G-Advanced continues to roll out, bringing AI/ML integration, integrated sensing and communication (ISAC), RedCap, and non-terrestrial network capabilities, support for 3rd Generation Partnership Project (3GPP) Release 19 (R19) is emerging, setting the stage for initial 6G deployment and testing. Qualcomm Technologies, for example, is already incorporating AI/ML into RF modems to control real-time signal conditions, dynamic impedance matching, and predictive power scaling.
Creating higher voltages, part 1: Voltage boosters
There are several ways to boost a relatively low AC or DC voltage by a factor of two or three, each with tradeoffs and constraints. Lower-voltage circuitry dominates much of design and associated discussions, with ICs and systems operating from five, three, and one, and even sub-one volt rails. There’s good reason for this: in general, such circuits require less power and have lower dissipation than higher-voltage circuits.