Embedded Computing Design
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Engineers and developers have different needs based on a variety of factors, which include geography, generation, or most important, which segment of the design cycle they are operating in. Embedded Computing Design understands the design engineer/developer and those needs. Hence, we provide the necessary and pertinent information how, when, and where it’s most useful. We segment the majority our coverage into the following categories: industrial, automotive, consumer; and medical/healthcare. The overriding technologies prevalent in everything we cover include IoT, security, AI/machine learning, and analog/power. Source
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| Scope | International, Trade/B2B |
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| Language | English |
| Country | United States of America |
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| Frequency | Bimonthly |
Recent Articles
Search ArticlesUsing Closed AI Models Can Minimize Your Risk
Blog Artificial intelligence is becoming a practical component of embedded systems, from predictive maintenance and motor control to machine vision, industrial automation, and smart building infrastructure. But as developers integrate AI into these products, they face a security question that extends beyond the accuracy of the model: Who controls the model, what data can it access, and how much of the system’s behavior can an attacker influence?
ICYMI Ep79: Peraso, SECO, electronica, Qualcomm
Video Hello Embedded Professionals, Engineers, and Developers! Welcome to In Case You Missed it, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design. It’s Friday October 21, 2026, I’m Ken Briodagh, Editor in Chief of Embedded Computing Design and these are our top stories this week.
Arcane Four Software Exhibits its Connected Product Software Stack at electronica 2026
News Image Credit: Arcane Four Software At this year’s electronica, Arcane Four Software will make its debut, showcasing its integrated approach to embedded software, human-machine interface (HMI), cloud, and mobile application development.
YOKOWO Highlights Electronic Connectors at electronica 2026
News Image Credit: YOKOWO YOKOWO CO., LTD. will make its fifth visit to electronica taking place between November 10th and 13th, 2026 at Messe München in Munich.
SECO to Showcase its SOM-SMARC-Dragonwing-IQ8 Module at electronica 2026
News Image Credit: SECO SECO will be attending electronica 2026, held from 10 to 13 November in Munich, Germany, where it will showcase its SOM-SMARC-Dragonwing-IQ8 module and Edge AI technologies. Visitors can learn more about how SECO’s modular hardware, AI development tools, and lifecycle software support OEMs developing intelligent connected products through Edge Lab LIVE! demonstrations, partner showcases across multiple halls, and two conference sessions.
Tape-Out Readiness Checklist: Engineering Decisions That Prevent Costly Respins
Blog Image Credit: MosChip Tape-out is a point where the ASIC design moves from bits and blocks to a piece of silicon. At that point in time, there should be a clear understanding of how the design will behave, perform, consume power, fit physically, be tested, and be manufactured.
Embedded Executive: Rethink How You Implement AI | Quadric
Podcast Just when you thought you’d heard all the different approaches to developing AI, another one comes along. Quadric claims to have done just that with an architecture that the company claims is cleaner and simpler than current approaches, yet improves performance substantially. Hear all about it from Quadric’s CEO and co-founder Veer Kheterpal on this week’s Embedded Executives podcast.
Peraso Demonstrates 60 GHz Wireless Connectivity for Humanoid Robots
News Peraso Inc. announced the successful completion of a functional validation demonstrating high-speed wireless connectivity between a humanoid robot and an edge AI server using Peraso's mmWave technology. According to the company, the demonstration achieved sustained data rates of approximately 500 Mbps uplink from the robot to the edge server and 100 Mbps downlink, enabling continuous transfer of sensor, video, telemetry, and operational data.
From Leakage Current Reliability to Supply Chain Stability: YMIN IDC3 Delivers a Reliable Snap-In Aluminum Electrolytic Capacitor Solution for AI Servers
Image Credit: YMIN 1. AI Servers Enter an Era of Sustained High Load: Abnormal Leakage Current Must Be Addressed Before Failure Occurs AI servers are increasingly operating under sustained, high-load conditions, placing greater demands on the stability and reliability of critical components.
The Future of Quantum is in the Foundry & Finding the Right Approach to Application Design
Podcast On this episode of Embedded Insiders, SkyWater Technology's Senior Vice President of Engineering, Percy Gilbert, joins the podcast to discuss what it takes to engineer chips for quantum computing. We dive into the state of quantum computing today and the importance of having advanced manufacturing capabilities in the U.S. Next, Rich and Vin are back with another Dev Talk with guest Ranganathan SK, the Associate Vice President of Product Engineering Services at MosChip Technologies.