Engineering.com

The XA P2N-E2 supports NVIDIA Vera CPUs and up to two dual-slot RTX PRO 6000 Blackwell Server Edition GPUs. ASUS is expanding its AI infrastructure portfolio with the launch of the XA P2N-E2, a 2U NVIDIA MGX architecture-based server powered by NVIDIA Vera CPUs and designed for agentic AI and reinforcement learning workloads.

The five-year partnership includes plans for scholarships, internships and joint research to prepare students for smart manufacturing careers. Purdue University and Rittal and Eplan celebrated the opening of two new learning labs in Dudley Hall.

The design supports up to 160 accelerators per pod and is expected to reach customers through OEM and ODM partners in Q1 2027. Astera Labs, Inc. announced Orion: a modular rack-scale reference design with production-grade connectivity that allows customers to choose their own GPU and CPU.

The design supports CPU-only and combined CPU-GPU configurations, with partner-developed systems planned for availability in November 2026. AMD introduced the AMD Helion agentic AI rack, an open blueprint for agentic AI infrastructure based on an Open Compute Project spec-design and powered by AMD compute.

The $535 million deal is expected to close in Q4 2026 and expand Hexagon’s mining and infrastructure monitoring capabilities. Hexagon AB announced that it has signed an agreement to acquire Rocscience, a leading provider of geotechnical and engineering analysis software, from TA Associates and Rocscience’s founders and management. Rocscience will become part of the Radar & Monitoring Division within Hexagon’s Infrastructure & Geospatial Business Area.

The ADC34DSO75 samples at 3 GSPS while TI also showcases 800 V power solutions and low-jitter clocking for AI infrastructure. At the Open Compute Project (OCP) Global Summit, Texas Instruments (TI) introduced the ADC34DSO75, an analog-to-digital converter (ADC) designed for continuous, low-power, event-based remote monitoring with nanosecond-level resolution. As AI workloads increase, data center operators are addressing power instability, real-time monitoring and signal degradation.

Its Crux reference design combines proprietary waveguide and display technologies with Snapdragon AR1+ Gen 1 for enterprise AR applications. Cellid Inc. announced that it has joined Snapdragon START (Snapdragon Scalable Turnkey AI-Ready Toolkit), a development support program for personal AI devices designed by Qualcomm Technologies, Inc.

The OSFP-sized design targets up to 12.8 Tb/s of aggregate capacity with 16 full-duplex lanes for AI factory networks. NVIDIA and Cisco announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a high-density optical module designed to support 400 Gb/s per lane in AI factory networks that use pluggable transceivers. As AI models and inference workloads expand, AI factories need to connect more computing systems while managing network complexity, power consumption and costs.

AWS is betting that reference architectures—not just raw compute—are what robotics teams need next. Amazon Web Services has introduced an open-source toolchain that combines AWS infrastructure with NVIDIA robotics software to support the development, training, simulation and deployment of physical AI systems.

Artec Twins combines point clouds, meshes and Gaussian Splats with tools for measurement, visualization and data analysis. Artec 3D has launched Artec Twins, a software platform for processing and rendering large 3D environments. The platform is designed to handle datasets containing billions of points and support digital-twin workflows for surveying, inspection, monitoring and related applications. Artec 3D has developed 3D capture and processing tools for more than 20 years.