Global Advanced Packaging

Wooptix, an innovation leader in semiconductor wavefront phase imaging metrology, announced the installation of its Phemet® system at CEA-Leti's Grenoble technology research institute, marking a significant milestone in the company's expansion into semiconductor metrology and process control. Installed on May 4, 2026, the system will support joint work on wafer-scale process signatures, nanotopography, and advanced packaging metrology in an industrial semiconductor cleanroom environment.

ACM Research, Inc., a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, announced it has shipped its first plasma-enhanced chemical vapor deposition (PECVD) silicon carbonitride (SiCN) system to a leading semiconductor manufacturer.

Resonac Corporation inaugurated a new R&D center to mark the full-scale launch of “US-JOINT,” a consortium of 12 Japanese and U.S. material and equipment manufacturers led by the company, with the goal of establishing new models for developing next-generation semiconductor-packaging technologies. To commemorate the occasion, a ceremony attended by government officials and participating companies from both countries was held at the consortium’s newly operational base in Silicon Valley on April 20.

Leading semiconductor test equipment supplier Advantest Corporation announced the opening of two Advantest Innovation Centers—one located on the company’s campus in San Jose, Calif., and another currently under construction in nearby Sunnyvale, Calif. The Advantest Innovation Center is a first-of-its-kind space offering state-of-the-art laboratories and advanced test equipment.