Jillian McNichol

Since 2009, when Francoise started 3D InCites, she’s been sharing her insights on advanced packaging – an industry, she told me, that people used to dismiss. “Back then, advanced packaging was still seen as a cost-adder, versus adding value through enhanced performance.”  she said. So much has changed since then. In 2009, the iPhone was still considered revolutionary. Now, the world is pushing for things we may have never believed possible.

I recently attended SEMICON Europa in Germany to learn how the EU is approaching the next phase of its semiconductor development. From what I learned, the EU is moving its industry forward by planning for its CHIPS Act 2.0 legislation, attracting new investments, and funding competitive R&D pilot programs. In addition, changing geopolitical conditions are also motivating the EU to bring more manufacturing capabilities to its member states.

Co-packaged optics is one of the most talked about innovations in advanced packaging right now, and it’s for good reason. It promises higher bandwidth density, lower power consumption, and reduced latency over other packaging approaches – all of which are essential for enabling smarter AI solutions. To learn more about current developments in co-packaged optics (CPO), I spoke with ASE’s Senior Technical Advisor, Bill Chen, and VP of Corporate R&D, C.P. Hung.