HPCwire

MADRID, June 29, 2026 — Openchip, a company specializing in the design and commercialization of high-performance, energy-efficient chips, has secured the backing of the Spanish Society for Technological Transformation (SETT), under the Ministry for Digital Transformation and Public Function, through a €115 million investment. The operation was authorized today by the Council of Ministers.

A Deeper Look at the Compute Demands of AI Adding more processors and accelerators alone is no longer enough to support modern AI and HPC environments. Performance increasingly depends on how efficiently compute resources interact with storage, networking, software, power delivery, and cooling across the entire infrastructure stack.

June 26, 2026 — On June 25, the German Climate Computing Center (DKRZ) welcomed a delegation of about 25 people from China. The visitors had previously attended the ISC High Performance Conference in Hamburg and took advantage of their stay to tour leading German high-performance computing centers. Credit: DKRZ The delegation consisted of scientists from the Chinese Academy of Sciences (CAS) as well as representatives from the company Sugon.

DARPA-funded effort will use Medra’s new scientific reasoning layer inside ML001, the company’s flagship autonomous science lab SAN FRANCISCO, June 26, 2026 — Medra has launched the AI Experimentalist, the scientific reasoning layer of its Physical AI Scientist Platform, and announced a project funded by the Defense Advanced Research Projects Agency (DARPA).

June 26, 2026 — Lawrence Livermore National Laboratory (LLNL) is contributing AI-enabled payload optimization and advanced modeling and simulation expertise to Aires Tide, a collaborative National Nuclear Security Administration (NNSA) demonstration exploring new ways to design flight test vehicles.

Qualcomm and Hugging Face Expand Relationship to Advance Open, Developer-Driven AI from Device to Cloud NEW YORK, June 26, 2026 — Qualcomm Technologies, Inc. has announced the expansion of its strategic relationship with Hugging Face to advance open, developer-driven artificial intelligence (AI) from devices to cloud infrastructure.

Swiss National Supercomputing Centre presented two papers at CUG 2026 exploring secure, multi-tenant supercomputing for sensitive data and the operational viability of VAST Data for HPC and AI workloads June 23, 2026 — VAST Data has announced that the Swiss National Supercomputing Centre (CSCS), part of ETH Zurich, presented two technical papers at the 2026 Cray User Group (CUG) conference in Nice, France, highlighting VAST Data’s role in advancing trusted, high-performance infrastructure for...

Germany’s national climate computing center modernizes critical HPC user environments to support faster development, simpler operations and more resilient scientific workflows. June 26, 2026 — VAST Data has announced that the German Climate Computing Center, Deutsches Klimarechenzentrum (DKRZ), has deployed the VAST AI Operating System to modernize a critical part of its high-performance computing environment for climate research.

NEW YORK, June 26, 2026 — Qualcomm Technologies, Inc. and Meta have announced a strategic multi-generation collaboration for Qualcomm Technologies to be a supplier for data center CPUs for Meta. Qualcomm Technologies’ data center CPU, the Qualcomm Dragonfly C1000, is planned to power Meta’s next-generation server fleet, underscoring the growing importance of high-performance, power-efficient compute in large-scale scale-out environments.

June 26, 2026 — To address the rapidly growing computational demands driven by generative artificial intelligence (AI), Taiwan’s National Center for High-performance Computing (NCHC) under the National Institutes of Applied Research (NIAR) officially launched its newest AI supercomputing system, “Nano4” (Chip Innovation 26), on June 1, 2026. The new system provides enhanced AI computing resources for academia, government agencies, and industry users.