I-Connect007
VerifiedOnline/Digital
I-Connect007 is the industry's longest running, electronics industry media portal providing information for readers around the world. Our mission is to consolidate pertinent industry information, to expand the reader's knowledge and improve their businesses. We also seek to foster communication throughout the global electronics supply chain, connecting designers, fabricators, contract manufacturers and OEMs. Information is presented in "real time" by industry sector in the form of electronic articles, interviews, news, market reports, event coverage, and breaking news stories. All information is presented in a user-friendly format that is easy to navigate. Source
Actions
Media Outlet details
| Scope | International |
|---|---|
| Language | English |
| Country | United States of America |
|
Similarweb UVM |
Request pricing |
|
Comscore UVM |
Request pricing |
Recent Articles
Search ArticlesStarlab, Global Venture Management Announce Strategic Investment
Starlab Space and Global Venture Management announced Global Venture Management's investment in Starlab. The investment adds to a deepening pool of institutional capital backing Starlab and signals continued confidence that Starlab – the U.S.-led, next-generation commercial space station – is the defining infrastructure play of the post-International Space Station (ISS) low-Earth orbit (LEO) economy.
Panasonic Industry to Transfer Germany, Slovakia Manufacturing Subsidiaries
Panasonic Industry Co., Ltd. (PID) announced that it entered into a share transfer agreement on August 17 with Midas Atlantic Partners, in partnership with The Najafi Companies, a leading U.S. investment firm.
Sila Earns ISO 9001:2015 Certification for Silicon Battery Manufacturing
Sila, an advanced battery technology company, announced it earned the ISO 9001:2015 certification for its Moses Lake, Washington manufacturing facility, an internationally recognized standard for quality management systems and an important milestone as Sila scales domestic production of its silicon-carbon anode technology (Si/C) to power critical applications across AI, autonomous vehicles, drones, satellites, robotics, and other critical technologies.
Micron Unveils U.S. Research Lab for Memory and AI Innovation
Micron Technology, Inc. unveiled Micron Research Labs, a U.S.-based long-horizon premier research institution headquartered in Boise and backed by a planned $10 billion investment over the next decade. Building on Micron’s technology and manufacturing leadership, the new hub will bring together customers, academia, government and the broader semiconductor ecosystem to pursue breakthroughs beyond today's technology roadmaps and help define what's possible in the decades ahead.
FRACTAL Unveils Mesh-to-Gateway D2D Satellite System
Fractal Antenna Systems, Inc. disclosed a patented and patent-pending Mesh-to-Gateway, or “M2G”, architecture for unlicensed Part 15 wireless networks with D2D/LEO satellites. This proposed satellite network enables ubiquitous connectivity for sensors, machine control, fleet management, IoT, robotics, and other Part 15 devices. Nathan Cohen, CEO of the firm, notes: “Unlicensed Part 15 devices have been wildly successful, and yet they can fail at the same time.
Nordson Reports Record Q3 FY2026, Raises Full-Year Guidance
Nordson Corporation reported results for the fiscal third quarter ended July 31, 2026. Sales were a quarterly record of $818 million, an increase of 10% compared to the prior year’s third quarter sales of $742 million. The third quarter 2026 sales included an organic sales increase of approximately 12% driven by growth in all segments. Organic sales growth was partially offset by the net unfavorable impact of a prior year divestiture and an acquisition in the second quarter.
Omdia: Foldable Smartphone Shipments to Double to 36 Million by 2028
The foldable smartphone market is expected to grow by more than 20% annually through 2028, with shipments reaching 36 million units, as leading vendors introduce innovative form factors, according to Omdia’s Smartphone Feature Forecast. Annual shipments are projected to more than double compared with 2025, supported by the emergence of a new wide-format design that is gaining adoption among major smartphone vendors.
Qnity Advances Node Materials Innovation with KLA Inspection Technology
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the installation of a Surfscan® SP7XP unpatterned wafer defect inspection system from KLA as part of its ongoing investment in advanced semiconductor materials innovation. The system enhances Qnity's ability to develop and manufacture leading-edge materials, deepening the process insight that supports customer technology roadmaps.
Sypris Wins Award for High-Volume LEO Satellite Program
Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received an award from a leading space technologies company to support the non-recurring engineering, material procurement, and high-volume manufacturing of power processing units for a next-generation satellite constellation. Production under the agreement includes protoflight and pilot builds beginning in Q3 2026, followed by phased delivery of flight units through mid-2028. Financial terms were not disclosed.
P Kay Metal's MS2 Dross Eliminator Delivers Measurable Results for Electronics Manufacturers Across Latin America
As electronics manufacturing continues to grow across Latin America, assemblers and OEMs are increasingly focused on improving efficiency and controlling material costs. One area delivering measurable results is solder recovery, where manufacturers are recovering more usable solder while reducing waste and operating expenses. P Kay Metal is seeing growing adoption of its MS2 Dross Eliminator throughout the region, with customers consistently reporting solder recovery rates of 80–85%.