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, Ryan Giang, Elena Moukhina, , , , , , Epoxy underfill materials are critical to advanced semiconductor packaging by enhancing mechanical integrity, redistributing thermomechanical stresses, and improving solder-joint reliability in flip-chip and other fine-pitch interconnect architectures.
Conflicts of Interest Dr. Elena Moukhina is an employee of NETZSCH-Gerätebau GmbH, the developer of the Netzsch Kinetics Neo software used for the kinetic modeling in this study. The other authors declare no conflicts of interest. Data Availability Statement Data associated with this paper are publicly available through the NIST Public Data Repository at https://doi.org/10.18434/mds2-4162.
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