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Abstract This investigation explores the electroless deposition of copper nanoparticles onto epoxy substrates using glyoxylic acid as the reducing agent. The deposition process was conducted under alkaline conditions, with the pH precisely maintained at 11.0 ± 0.25 using potassium hydroxide. Two distinct methanesulphonate bath formulations were employed with glucose and fructose as chelators to enhance complexation efficiency.
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