Chemical mechanical planarization (CMP) slurry and pads are essential in the polishing process. The slurry is a mixture of chemical agents and fine abrasives that facilitate controlled surface material removal. The pads act as a supportive surface, ensuring even contact and consistent slurry distribution. This combination allows mechanical and chemical actions to work together, achieving precise and uniform planarization of surfaces. The main product categories in CMP include slurries and pads.
