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We propose superconducting-semiconducting (super-semi) qubit and coupler designs based on high-quality compact through-silicon vias (TSVs) to overcome challenges introduced by materials and processing required to fabricate high-quality super-semi Josephson junctions. In our designs, an interposer “probe” wafer containing TSVs is used to contact a sample wafer with, e.g., a superconductor-proximitized epitaxially grown germanium quantum well.
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