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Ahmad Barari

As seen in: Journal of Manufacturing and Materials Processing, MDPI
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Articles

Structural Design with Self-Weight and Inertial Loading Using Simulated Annealing for Non-Gradient Topology Optimization

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By Thiago Martins, Ahmad Barari, Hossein Rostami Najafabadi, Rostami Najafabadi
| MDPI
All articles published by MDPI are made immediately available worldwide under an open access license. No special permission is required to reuse all or part of the article published by MDPI, including figures and tables. For articles published under an open access Creative Common CC BY license, any part of the article may be reused without permission provided that the original article is clearly cited. For more information, please refer to https://www.mdpi.com/openaccess.
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Skin Imaging: A Digital Twin for Geometric Deviations on Manufactured Surfaces

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By Ahmad Barari, Elnaz Ghanbary Kalajahi, Mehran Mahboubkhah, Ghanbary Kalajahi
| MDPI
All articles published by MDPI are made immediately available worldwide under an open access license. No special permission is required to reuse all or part of the article published by MDPI, including figures and tables. For articles published under an open access Creative Common CC BY license, any part of the article may be reused without permission provided that the original article is clearly cited. For more information, please refer to https://www.mdpi.com/openaccess.
Open in Who Shared View Duplicates (42) Issue with article?

Dimensional Tolerances in Mechanical Assemblies: A Cost-Based Optimization Approach

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By Ahmad Barari, Oswaldo Horikawa, Marcos Guerra, Eduardo Umaras
| MDPI
This is an early access version, the complete PDF, HTML, and XML versions will be available soon. Open AccessArticle by 1, 2, 1 and Marcos Sales Guerra Tsuzuki 1,* 1 Laboratory of Computational Geometry, Escola Politécnica da Universidade de São Paulo, São Paulo 05508-010, Brazil 2 Faculty of Engineering and Applied Science, University of Ontario Institute of Technology (Ontario Tech), Oshawa, ON L1G 0C5, Canada * Author to whom correspondence should be addressed. Appl. Sci.
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