Antony Winata Hartanto

1 Introduction Integrated circuits (ICs) have been steadily scaling down over the past few decades,[1, 2] driven by the ever-growing demand for higher computational power and efficiency. The resulting rapid increase in the spatial density of IC elements, such as transistors, has led to the respective shrinking in the dimensions of metal interconnects,[3, 4] with the smallest of them currently being only ≈10 nm in width.