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Nanodroplet-Confined Electroplating Enables Submicron Printing of Metals and Oxide Ceramics Click to copy article link Article link copied!

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By Rebecca A. Gallivan, Mirco Nydegger, Arthur Barras
| dx.doi.org
Electroplating is a long-established and foundational technique in materials science that enables the controlled deposition of metals and compounds onto conductive substrates through electrochemical reduction. (4) The technique relies on an ionic exchange through a continuous electrolyte medium and is therefore traditionally performed in bulk electrolytic cells with well-defined anode–cathode configurations to deposit metal coatings.
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