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Don Clark on Muck Rack

Don Clark

(He/Him)
San Francisco
As seen in: The New York Times, MSN, The New York Times en Español, UOL, ETAuto, ETCIO, ETCISO, ETTech.com, ETTelecom, MSN India, The Economic Times and
Covers:  Semiconductors and computing-related hardware, a small sideline in big enterprise tech companies
Doesn't Cover: Startups (with the exception of chip-related companies)
More than 40 years covering tech, now freelancing on chips and enterprise tech for the New York Times--and playing a lot of music. donclarktunes@gmail.com

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Don Clark’s Biography

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I've covered tech for nearly all of the past 45 years. Currently I freelance for the New York Times, mainly on semiconductors. My career started with six years at the St. Paul Pioneer Press, seven years at the San Francisco Chronicle and 23 years at the Wall Street Journal.

Articles

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By Don Clark
| The New York Times Verified
The artificial intelligence boom has lifted chipmakers including Nvidia, Micron and South Korea’s SK Hynix. Now Intel, which has begun rebounding from a lengthy slump, is benefiting from a new shift in A.I. spending. Tech firms are not only buying A.I. chips known as graphics processing units, made by companies like Nvidia, but also increasingly purchasing microprocessors known as central processing units — which are exactly what Intel makes.
Open in Who Shared View Duplicates (4) Issue with article?

How a niche technology became a choke point for AI

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By Don Clark
| The Seattle Times Verified
SAN FRANCISCO — Subramanian Iyer, an electrical engineer and educator, has long specialized in a sleepy niche of the semiconductor industry that has now become a major choke point in the global contest for artificial intelligence leadership. That niche is a technology called advanced chip packaging, which bundles as many as dozens of the components in palm-size modules.
Open in Who Shared Issue with article?

How a Niche Technology Became a Choke Point for A.I.

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By Don Clark, Gabriela Bhaskar Verified
| The New York Times Verified
Subramanian Iyer, an electrical engineer and educator, has long specialized in a sleepy niche of the semiconductor industry that has now become a major choke point in the global contest for artificial intelligence leadership. That niche is a technology called advanced chip packaging, which bundles as many as dozens of the components in palm-size modules.
Open in Who Shared Issue with article?
See all 1,192 licensed articles (1,346 Total)