Ethan Xinghan TanPurdue

As 3D heterogeneous integration emerges as a state-of-the-art solution for advanced packaging, the reliability of interlayer bonding and interconnects becomes a critical concern. Hybrid bonding, where dielectric and copper surfaces are simultaneously and directly bonded, has gained prominence as a leading technique due to its potential for lower bonding energy and improved interconnect reliability compared to conventional methods.

Abstract As 3D heterogeneous integration becomes the state-of-the art solution to advanced packaging, bonding reliability between layers becomes a key challenge. Hybrid bonding, which bond dielectric and copper surfaces simultaneously and directly to themselves, has emerged as a leading technique. Recent research has proposed polyimide as a substitute for traditional oxide dielectrics due to its thermal stability and lower bonding temperature.