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Articles

Optimizing Bond Line Thickness for Maximum Heat Transfer

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By GDPR Compliance
| 3D InCites Verified
In thermal interface applications, bond line thickness is one of the most critical—and often overlooked—factors affecting heat dissipation. Understanding the relationship between bond line geometry and thermal performance can help engineers maximize heat transfer without over-engineering their designs. Bond line thickness and heat transfer are inversely proportional.
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Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design

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By GDPR Compliance
| 3D InCites Verified
Combines Siemens’ EDA expertise and software with NVIDIA AI infrastructure and software to improve result quality, time-to-results, tool-calling reliability and token efficiency for long-running engineering workloads Enables agentic AI workflows that help engineers improve productivity and design quality across the electronic design automation (EDA) lifecycle Delivers more predictable, trusted outcomes through physics-based EDA software validation Integrates with Siemens’ Intelligence Center...
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Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure

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By GDPR Compliance
| 3D InCites Verified
Amkor Technology, Inc. today announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. Under the agreement, NVIDIA will provide a prepayment to support the expansion of Amkor’s U.S. advanced packaging capacity. Advanced packaging enables the performance, energy efficiency and system-level integration required for AI infrastructure.
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