Giuseppe Barillaro

Abstract On-chip inductors are essential components of radio-frequency integrated circuits, yet their large footprint and limited scalability constrain chip miniaturization and increase manufacturing costs. Here we show a method for integrating three-dimensional metal microinductors directly onto chip contact pads using high-precision electrodeposition. The resulting freestanding coils extend above the chip surface, decoupling their inductance from the planar silicon area they occupy.

Abstract One of the major challenges in the rapidly advancing field of nanophotonics is creating high-aspect-ratio nanostructures over large-area with consistent precision. Traditional techniques like photolithography and etching fall short, being limited to fabricating structures with a typical feature size of 100 nm and a maximum aspect ratio of 30:1.

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