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Magnetic‐Field‐Induced Three‐Dimensional Networks to Enhance the Thermal Conductivity for Polydimethylsiloxane‐Based Thermal Interface Materials
Conflicts of Interest The authors declare no conflicts of interest. References 1, , , et al., “Liquid-Infused Nanostructured Composite as a High-Performance Thermal Interface Material for Effective Cooling,” Nature Communications 16 (2025): 794. 2, , , et al., “Highly Thermally Conductive and Soft Thermal Interface Materials Based on Vertically Oriented Boron Nitride Film,” Composites Part B: Engineering 272 (2024): 111219.
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