“Beyond Moore’s Law: The chiplet revolution in semiconductor packaging,” was a keynote presentation given by Dr. Yasumitsu Orii, senior executive managing officer at Rapidus Corporation, at SPIE Advanced Lithography + Patterning this year. Orii worked at IBM Japan in 1986 and became a leading expert in flip chip organic packaging, contributing to the performance gains and miniaturization of servers, laptops, and hard disk drives.