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Articles

[2606.27612] Enhancing Co-packaging Optics Enabled Silicon Photonics Security Assurance Hardware Fingerprinting

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By Liton Kumar, M M, Himanandhan Reddy Kottur
| arXiv
arXivLabs is a framework that allows collaborators to develop and share new arXiv features directly on our website. Both individuals and organizations that work with arXivLabs have embraced and accepted our values of openness, community, excellence, and user data privacy. arXiv is committed to these values and only works with partners that adhere to them. Have an idea for a project that will add value for arXiv's community? Learn more about arXivLabs.
Open in Who Shared View Duplicates (700) Issue with article?

Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging

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By Himanandhan Reddy Kottur
| chiplet-marketplace.com
By Himanandhan Reddy Kottur, Pavanbabu Arjunamahanthi, M. Shafkat M. Khan, Liton Kumar Biswas, Nitin Varshney and Navid Asadizanjani Department of Electrical and Computer Engineering, University of Florida, Florida, USA As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated attacks such as tampering, counterfeiting, and supply chain infiltration.
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