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The effect of matrix morphology and Cu-coated SiC content on the mechanical and electrical properties of novel Cu–SiC composites
Abstract In this study, the effects of Cu matrix morphology and Cu-coated SiC reinforcement ratio on the microstructure, mechanical, and electrical properties of Cu-SiC composites were investigated. Dendritic and flake morphologies were used as Cu matrix morphologies, while Cu-coated SiC particle ratios were selected as 5, 10, and 20% by volume.
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