Jerry Murphy

Siemens’ Innovator3D IC software was recognized for advancing 2.5D and 3D chiplet integration. Feb. 19, 2026 — Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC solution. The solution provides a fast, predictable pathfinding, planning and heterogeneous integration of ASICs and chiplets using advanced 2.5D and 3D packaging technologies.

The investment enables Price to meet growing demand and strengthen its position as the leader in woodyard operations in North America. Feb. 19, 2026 — Valmet has received an order from The Price Companies to deliver a new debarking and chipping line to support increased wood chip supply at one of their operations in Georgia, the USA. The investment enables Price to meet growing demand and strengthen its position as the leader in woodyard operations in North America.

ISA provides technical resources and standards to help industrial automation professionals advance their careers and the field. We enable automation professionals worldwide to solve problems and enhance their skills by bringing people together to create new technologies and share best practices with future automation professionals. The new software package provides modular architecture with multi-core and multi-tasking support for multi-axis motion control. SAVAGE, Minnesota, Feb.