KexinLin, HanYan, KaipengWang, MingqingLiao, KaiQi, FengjiangWang, Advanced Engineering Materials2026, 0, e70823. https://doi.org/10.1002/adem.70823 Conflicts of Interest The authors declare no conflicts of interest. Data Availability Statement Data will be made available on request. References 1, , , , and , “Thermomigration in Solder Joints,” Materials Science and Engineering: R: Reports 73, no. 9–10 (2012): 85–100.